A fully integrated RF front-end for W-CDMA applications including a low noise amplifier, a down conversion mixer, a digitally programmable gain amplifier, an on-chip VCO, and a fractional-N frequency synthesizer is designed using a 0.35-µm CMOS process. A multi-stage ring shaped on-chip LC-VCO exhibiting bandpass characteristics overcomes the limitation of low-Q components in the tank circuits and improves the phase noise performance. The measured phase noise of the on-chip VCO is -134 dBc/Hz at 1 MHz offset. The receiver RF front-end achieves a NF of 3.5 dB, an IIP3 of -16 dBm, and a maximum gain of 80 dB. The receiver consumes 52 mA with a 3-V supply and occupies only 2 mm2 die area with minimal external components.
The copyright of the original papers published on this site belongs to IEICE. Unauthorized use of the original or translated papers is prohibited. See IEICE Provisions on Copyright for details.
Copy
Hyung Ki AHN, Kyoohyun LIM, Chan-Hong PARK, Jae Joon KIM, Beomsup KIM, "A Fully Integrated CMOS RF Front-End with On-Chip VCO for W-CDMA Applications" in IEICE TRANSACTIONS on Electronics,
vol. E87-C, no. 6, pp. 1047-1053, June 2004, doi: .
Abstract: A fully integrated RF front-end for W-CDMA applications including a low noise amplifier, a down conversion mixer, a digitally programmable gain amplifier, an on-chip VCO, and a fractional-N frequency synthesizer is designed using a 0.35-µm CMOS process. A multi-stage ring shaped on-chip LC-VCO exhibiting bandpass characteristics overcomes the limitation of low-Q components in the tank circuits and improves the phase noise performance. The measured phase noise of the on-chip VCO is -134 dBc/Hz at 1 MHz offset. The receiver RF front-end achieves a NF of 3.5 dB, an IIP3 of -16 dBm, and a maximum gain of 80 dB. The receiver consumes 52 mA with a 3-V supply and occupies only 2 mm2 die area with minimal external components.
URL: https://global.ieice.org/en_transactions/electronics/10.1587/e87-c_6_1047/_p
Copy
@ARTICLE{e87-c_6_1047,
author={Hyung Ki AHN, Kyoohyun LIM, Chan-Hong PARK, Jae Joon KIM, Beomsup KIM, },
journal={IEICE TRANSACTIONS on Electronics},
title={A Fully Integrated CMOS RF Front-End with On-Chip VCO for W-CDMA Applications},
year={2004},
volume={E87-C},
number={6},
pages={1047-1053},
abstract={A fully integrated RF front-end for W-CDMA applications including a low noise amplifier, a down conversion mixer, a digitally programmable gain amplifier, an on-chip VCO, and a fractional-N frequency synthesizer is designed using a 0.35-µm CMOS process. A multi-stage ring shaped on-chip LC-VCO exhibiting bandpass characteristics overcomes the limitation of low-Q components in the tank circuits and improves the phase noise performance. The measured phase noise of the on-chip VCO is -134 dBc/Hz at 1 MHz offset. The receiver RF front-end achieves a NF of 3.5 dB, an IIP3 of -16 dBm, and a maximum gain of 80 dB. The receiver consumes 52 mA with a 3-V supply and occupies only 2 mm2 die area with minimal external components.},
keywords={},
doi={},
ISSN={},
month={June},}
Copy
TY - JOUR
TI - A Fully Integrated CMOS RF Front-End with On-Chip VCO for W-CDMA Applications
T2 - IEICE TRANSACTIONS on Electronics
SP - 1047
EP - 1053
AU - Hyung Ki AHN
AU - Kyoohyun LIM
AU - Chan-Hong PARK
AU - Jae Joon KIM
AU - Beomsup KIM
PY - 2004
DO -
JO - IEICE TRANSACTIONS on Electronics
SN -
VL - E87-C
IS - 6
JA - IEICE TRANSACTIONS on Electronics
Y1 - June 2004
AB - A fully integrated RF front-end for W-CDMA applications including a low noise amplifier, a down conversion mixer, a digitally programmable gain amplifier, an on-chip VCO, and a fractional-N frequency synthesizer is designed using a 0.35-µm CMOS process. A multi-stage ring shaped on-chip LC-VCO exhibiting bandpass characteristics overcomes the limitation of low-Q components in the tank circuits and improves the phase noise performance. The measured phase noise of the on-chip VCO is -134 dBc/Hz at 1 MHz offset. The receiver RF front-end achieves a NF of 3.5 dB, an IIP3 of -16 dBm, and a maximum gain of 80 dB. The receiver consumes 52 mA with a 3-V supply and occupies only 2 mm2 die area with minimal external components.
ER -