Recent Progress in the Development of Large-Capacity Integrated Silicon Photonics Transceivers

Yu TANAKA

doi:10.1587/transele.2018ODI0007

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Recent Progress in the Development of Large-Capacity Integrated Silicon Photonics Transceivers

Yu TANAKA

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Summary :

We report our recent progress in silicon photonics integrated device technology targeting on-chip-level large-capacity optical interconnect applications. To realize high-capacity data transmission, we successfully developed on-package-type silicon photonics integrated transceivers and demonstrated simultaneous 400 Gbps operation. 56 Gbps pulse-amplitude-modulation (PAM) 4 and wavelength-division-multiplexing technologies were also introduced to enhance the transmission capacity.

Publication: IEICE TRANSACTIONS on Electronics Vol.E102-C No.4 pp.357-363

Publication Date: 2019/04/01

Publicized

Online ISSN: 1745-1353

DOI: 10.1587/transele.2018ODI0007

Type of Manuscript: Special Section INVITED PAPER (Special Section on Progress in Optical Device Technology for Increasing Data Transmission Capacity)

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Authors

Yu TANAKA
Photonics Electronics Technology Research Association (PETRA),Fujitsu Laboratories Limited,Fujitsu Limited

Keyword

silicon photonics, optical interconnection, wavelength division multiplexing

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Yu TANAKA, "Recent Progress in the Development of Large-Capacity Integrated Silicon Photonics Transceivers" in IEICE TRANSACTIONS on Electronics, vol. E102-C, no. 4, pp. 357-363, April 2019, doi: 10.1587/transele.2018ODI0007.
Abstract: We report our recent progress in silicon photonics integrated device technology targeting on-chip-level large-capacity optical interconnect applications. To realize high-capacity data transmission, we successfully developed on-package-type silicon photonics integrated transceivers and demonstrated simultaneous 400 Gbps operation. 56 Gbps pulse-amplitude-modulation (PAM) 4 and wavelength-division-multiplexing technologies were also introduced to enhance the transmission capacity.
URL: https://global.ieice.org/en_transactions/electronics/10.1587/transele.2018ODI0007/_p

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@ARTICLE{e102-c_4_357,
author={Yu TANAKA, },
journal={IEICE TRANSACTIONS on Electronics},
title={Recent Progress in the Development of Large-Capacity Integrated Silicon Photonics Transceivers},
year={2019},
volume={E102-C},
number={4},
pages={357-363},
abstract={We report our recent progress in silicon photonics integrated device technology targeting on-chip-level large-capacity optical interconnect applications. To realize high-capacity data transmission, we successfully developed on-package-type silicon photonics integrated transceivers and demonstrated simultaneous 400 Gbps operation. 56 Gbps pulse-amplitude-modulation (PAM) 4 and wavelength-division-multiplexing technologies were also introduced to enhance the transmission capacity.},
keywords={},
doi={10.1587/transele.2018ODI0007},
ISSN={1745-1353},
month={April},}

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TY - JOUR
TI - Recent Progress in the Development of Large-Capacity Integrated Silicon Photonics Transceivers
T2 - IEICE TRANSACTIONS on Electronics
SP - 357
EP - 363
AU - Yu TANAKA
PY - 2019
DO - 10.1587/transele.2018ODI0007
JO - IEICE TRANSACTIONS on Electronics
SN - 1745-1353
VL - E102-C
IS - 4
JA - IEICE TRANSACTIONS on Electronics
Y1 - April 2019
AB - We report our recent progress in silicon photonics integrated device technology targeting on-chip-level large-capacity optical interconnect applications. To realize high-capacity data transmission, we successfully developed on-package-type silicon photonics integrated transceivers and demonstrated simultaneous 400 Gbps operation. 56 Gbps pulse-amplitude-modulation (PAM) 4 and wavelength-division-multiplexing technologies were also introduced to enhance the transmission capacity.
ER -