IEICE TRANSACTIONS on Electronics
A Low Insertion Loss Wideband Bonding-Wire Based Interconnection for 400 Gbps PAM4 Transceivers
Summary :
This paper proposes a design of high-speed interconnection between optical modules and electrical modules via bonding-wires and coplanar waveguide transmission lines on printed circuit boards for 400 Gbps 4-channel optical communication systems. In order to broaden the interconnection bandwidth, interdigitated capacitors were integrated with GSG pads on chip for the first time. Simulation results indicate the reflection coefficient is below -10 dB from DC to 53 GHz and the insertion loss is below 1 dB from DC to 45 GHz. Both indicators show that the proposed interconnection structure can effectively satisfy the communication bandwidth requirements of 100-Gbps or even higher data-rate PAM4 signals.
- Publication
- IEICE TRANSACTIONS on Electronics Vol.E106-C No.1 pp.14-19
- Publication Date
- 2023/01/01
- Publicized
- 2022/06/23
- Online ISSN
- 1745-1353
- DOI
- 10.1587/transele.2022ECP5011
- Type of Manuscript
- PAPER
- Category
- Electronic Components
Authors
Xiangyu MENG
Sun Yat-sen University
Yecong LI
Sun Yat-sen University
Zhiyi YU
Sun Yat-sen University
Keyword
Latest Issue
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Xiangyu MENG, Yecong LI, Zhiyi YU, "A Low Insertion Loss Wideband Bonding-Wire Based Interconnection for 400 Gbps PAM4 Transceivers" in IEICE TRANSACTIONS on Electronics,
vol. E106-C, no. 1, pp. 14-19, January 2023, doi: 10.1587/transele.2022ECP5011.
Abstract: This paper proposes a design of high-speed interconnection between optical modules and electrical modules via bonding-wires and coplanar waveguide transmission lines on printed circuit boards for 400 Gbps 4-channel optical communication systems. In order to broaden the interconnection bandwidth, interdigitated capacitors were integrated with GSG pads on chip for the first time. Simulation results indicate the reflection coefficient is below -10 dB from DC to 53 GHz and the insertion loss is below 1 dB from DC to 45 GHz. Both indicators show that the proposed interconnection structure can effectively satisfy the communication bandwidth requirements of 100-Gbps or even higher data-rate PAM4 signals.
URL: https://global.ieice.org/en_transactions/electronics/10.1587/transele.2022ECP5011/_p
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@ARTICLE{e106-c_1_14,
author={Xiangyu MENG, Yecong LI, Zhiyi YU, },
journal={IEICE TRANSACTIONS on Electronics},
title={A Low Insertion Loss Wideband Bonding-Wire Based Interconnection for 400 Gbps PAM4 Transceivers},
year={2023},
volume={E106-C},
number={1},
pages={14-19},
abstract={This paper proposes a design of high-speed interconnection between optical modules and electrical modules via bonding-wires and coplanar waveguide transmission lines on printed circuit boards for 400 Gbps 4-channel optical communication systems. In order to broaden the interconnection bandwidth, interdigitated capacitors were integrated with GSG pads on chip for the first time. Simulation results indicate the reflection coefficient is below -10 dB from DC to 53 GHz and the insertion loss is below 1 dB from DC to 45 GHz. Both indicators show that the proposed interconnection structure can effectively satisfy the communication bandwidth requirements of 100-Gbps or even higher data-rate PAM4 signals.},
keywords={},
doi={10.1587/transele.2022ECP5011},
ISSN={1745-1353},
month={January},}
Copy
TY - JOUR
TI - A Low Insertion Loss Wideband Bonding-Wire Based Interconnection for 400 Gbps PAM4 Transceivers
T2 - IEICE TRANSACTIONS on Electronics
SP - 14
EP - 19
AU - Xiangyu MENG
AU - Yecong LI
AU - Zhiyi YU
PY - 2023
DO - 10.1587/transele.2022ECP5011
JO - IEICE TRANSACTIONS on Electronics
SN - 1745-1353
VL - E106-C
IS - 1
JA - IEICE TRANSACTIONS on Electronics
Y1 - January 2023
AB - This paper proposes a design of high-speed interconnection between optical modules and electrical modules via bonding-wires and coplanar waveguide transmission lines on printed circuit boards for 400 Gbps 4-channel optical communication systems. In order to broaden the interconnection bandwidth, interdigitated capacitors were integrated with GSG pads on chip for the first time. Simulation results indicate the reflection coefficient is below -10 dB from DC to 53 GHz and the insertion loss is below 1 dB from DC to 45 GHz. Both indicators show that the proposed interconnection structure can effectively satisfy the communication bandwidth requirements of 100-Gbps or even higher data-rate PAM4 signals.
ER -
English
