We have proposed integrated waveguide structure suitable for mid- and near- infrared light propagation using Si and CaF₂ heterostructures on Si substrate. Using a fabrication process based on etching, lithography and crystal growth techniques, we have formed a slab-waveguide structure with a current injection mechanism on a SOI substrate, which would be a key component for Si/CaF₂ quantum cascade lasers and other optical integrated systems. The propagation of light at a wavelength of 1.55 µm through a Si/CaF₂ waveguide structure have been demonstrated for the first time using a structure with a Si/CaF₂ multilayered core with 610-nm-thick, waveguide width of 970 nm, which satisfies single-mode condition in the horizontal direction within a tolerance of fabrication accuracy. The waveguide loss for transverse magnetic (TM) mode has been evaluated to be 51.4 cm^-1. The cause of the loss was discussed by estimating the edge roughness scattering and free carrier absorption, which suggests further reduction of the loss would be possible.

This paper proposes a low-power 100Gb/s four-level pulse amplitude modulation driver (PAM-4 Driver) based on linear distortion compensation structure for thin-film Lithium Niobate (LiNbO3) modulators, which manages to achieve high linearity in the output. The inductive peaking technology and open drain structure enable the overall circuit to achieve a 31-GHz bandwidth. With an area of 0.292 mm², the proposed PAM-4 driver chip is designed in a 65-nm process to achieve power consumption of 37.7 mW. Post-layout simulation results show that the power efficiency is 0.37 mW/Gb/s, RLM is more than 96%, and the FOM value is 8.84.

This paper proposes a design of high-speed interconnection between optical modules and electrical modules via bonding-wires and coplanar waveguide transmission lines on printed circuit boards for 400 Gbps 4-channel optical communication systems. In order to broaden the interconnection bandwidth, interdigitated capacitors were integrated with GSG pads on chip for the first time. Simulation results indicate the reflection coefficient is below -10 dB from DC to 53 GHz and the insertion loss is below 1 dB from DC to 45 GHz. Both indicators show that the proposed interconnection structure can effectively satisfy the communication bandwidth requirements of 100-Gbps or even higher data-rate PAM4 signals.