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IEICE TRANSACTIONS on Electronics

Open Access
Where, When, and How mmWave is Used in 5G and Beyond

Kei SAKAGUCHI, Thomas HAUSTEIN, Sergio BARBAROSSA, Emilio Calvanese STRINATI, Antonio CLEMENTE, Giuseppe DESTINO, Aarno PÄRSSINEN, Ilgyu KIM, Heesang CHUNG, Junhyeong KIM, Wilhelm KEUSGEN, Richard J. WEILER, Koji TAKINAMI, Elena CECI, Ali SADRI, Liang XIAN, Alexander MALTSEV, Gia Khanh TRAN, Hiroaki OGAWA, Kim MAHLER, Robert W. HEATH Jr.

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Summary :

Wireless engineers and business planners commonly raise the question on where, when, and how millimeter-wave (mmWave) will be used in 5G and beyond. Since the next generation network is not just a new radio access standard, but also an integration of networks for vertical markets with diverse applications, answers to the question depend on scenarios and use cases to be deployed. This paper gives four 5G mmWave deployment examples and describes in chronological order the scenarios and use cases of their probable deployment, including expected system architectures and hardware prototypes. The first example is a 28 GHz outdoor backhauling for fixed wireless access and moving hotspots, which will be demonstrated at the PyeongChang Winter Olympic Games in 2018. The second deployment example is a 60 GHz unlicensed indoor access system at the Tokyo-Narita airport, which is combined with Mobile Edge Computing (MEC) to enable ultra-high speed content download with low latency. The third example is mmWave mesh network to be used as a micro Radio Access Network (µ-RAN), for cost-effective backhauling of small-cell Base Stations (BSs) in dense urban scenarios. The last example is mmWave based Vehicular-to-Vehicular (V2V) and Vehicular-to-Everything (V2X) communications system, which enables automated driving by exchanging High Definition (HD) dynamic map information between cars and Roadside Units (RSUs). For 5G and beyond, mmWave and MEC will play important roles for a diverse set of applications that require both ultra-high data rate and low latency communications.

Publication
IEICE TRANSACTIONS on Electronics Vol.E100-C No.10 pp.790-808
Publication Date
2017/10/01
Publicized
Online ISSN
1745-1353
DOI
10.1587/transele.E100.C.790
Type of Manuscript
Special Section INVITED PAPER (Special Section on Microwave and Millimeter-Wave Technology)
Category

Authors

Kei SAKAGUCHI
  Fraunhofer HHI,Tokyo Institute of Technology
Thomas HAUSTEIN
  Fraunhofer HHI
Sergio BARBAROSSA
  Sapienza University of Rome
Emilio Calvanese STRINATI
  CEA/LETI Labs -- MINATEC
Antonio CLEMENTE
  CEA/LETI Labs -- MINATEC
Giuseppe DESTINO
  University of Oulu
Aarno PÄRSSINEN
  University of Oulu
Ilgyu KIM
  ETRI
Heesang CHUNG
  ETRI
Junhyeong KIM
  ETRI
Wilhelm KEUSGEN
  Fraunhofer HHI
Richard J. WEILER
  Fraunhofer HHI
Koji TAKINAMI
  Panasonic Corporation
Elena CECI
  Sapienza University of Rome
Ali SADRI
  Intel Corporation
Liang XIAN
  Intel Corporation
Alexander MALTSEV
  Intel Corporation
Gia Khanh TRAN
  Tokyo Institute of Technology
Hiroaki OGAWA
  Tokyo Institute of Technology
Kim MAHLER
  Fraunhofer HHI
Robert W. HEATH Jr.
  The University of Texas at Austin

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