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Study on Surface Characteristic of the Copper Nitride Films by Absorbed Oxygen
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Summary :
The copper nitride surface characteristics according to atmospheric pressure plasma (APP) and excimer ultraviolet (EUV) treatment were compared using XPS and AFM. As the result of XPS analysis result, in C1s, the organic material removal effect was greater for EUV treatment than for APP, and the oxygen content was found to be low. In Cu (933 eV) area, the shoulder peak of Cu compound was detected, and the reduction was greater for EUV processing than for APP. In the AFM phase image which could be analyzed using the superficial viscoelasticity, the same trend was observed. On the copper nitride surface, the weak boundary O layer is formed according to the clean processing, and such phenomenon was interpreted as a factor for lowering the affinity with polymer.
- Publication
- IEICE TRANSACTIONS on Electronics Vol.E95-C No.11 pp.1744-1748
- Publication Date
- 2012/11/01
- Publicized
- Online ISSN
- 1745-1353
- DOI
- 10.1587/transele.E95.C.1744
- Type of Manuscript
- Special Section INVITED PAPER (Special Section on Electronic Displays)
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Musun KWAK, Jongho JEON, Kyoungri KIM, Yoonseon YI, Sangjin AN, Donsik CHOI, Youngseok CHOI, Kyongdeuk JEONG, "Study on Surface Characteristic of the Copper Nitride Films by Absorbed Oxygen" in IEICE TRANSACTIONS on Electronics,
vol. E95-C, no. 11, pp. 1744-1748, November 2012, doi: 10.1587/transele.E95.C.1744.
Abstract: The copper nitride surface characteristics according to atmospheric pressure plasma (APP) and excimer ultraviolet (EUV) treatment were compared using XPS and AFM. As the result of XPS analysis result, in C1s, the organic material removal effect was greater for EUV treatment than for APP, and the oxygen content was found to be low. In Cu (933 eV) area, the shoulder peak of Cu compound was detected, and the reduction was greater for EUV processing than for APP. In the AFM phase image which could be analyzed using the superficial viscoelasticity, the same trend was observed. On the copper nitride surface, the weak boundary O layer is formed according to the clean processing, and such phenomenon was interpreted as a factor for lowering the affinity with polymer.
URL: https://global.ieice.org/en_transactions/electronics/10.1587/transele.E95.C.1744/_p
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@ARTICLE{e95-c_11_1744,
author={Musun KWAK, Jongho JEON, Kyoungri KIM, Yoonseon YI, Sangjin AN, Donsik CHOI, Youngseok CHOI, Kyongdeuk JEONG, },
journal={IEICE TRANSACTIONS on Electronics},
title={Study on Surface Characteristic of the Copper Nitride Films by Absorbed Oxygen},
year={2012},
volume={E95-C},
number={11},
pages={1744-1748},
abstract={The copper nitride surface characteristics according to atmospheric pressure plasma (APP) and excimer ultraviolet (EUV) treatment were compared using XPS and AFM. As the result of XPS analysis result, in C1s, the organic material removal effect was greater for EUV treatment than for APP, and the oxygen content was found to be low. In Cu (933 eV) area, the shoulder peak of Cu compound was detected, and the reduction was greater for EUV processing than for APP. In the AFM phase image which could be analyzed using the superficial viscoelasticity, the same trend was observed. On the copper nitride surface, the weak boundary O layer is formed according to the clean processing, and such phenomenon was interpreted as a factor for lowering the affinity with polymer.},
keywords={},
doi={10.1587/transele.E95.C.1744},
ISSN={1745-1353},
month={November},}
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TY - JOUR
TI - Study on Surface Characteristic of the Copper Nitride Films by Absorbed Oxygen
T2 - IEICE TRANSACTIONS on Electronics
SP - 1744
EP - 1748
AU - Musun KWAK
AU - Jongho JEON
AU - Kyoungri KIM
AU - Yoonseon YI
AU - Sangjin AN
AU - Donsik CHOI
AU - Youngseok CHOI
AU - Kyongdeuk JEONG
PY - 2012
DO - 10.1587/transele.E95.C.1744
JO - IEICE TRANSACTIONS on Electronics
SN - 1745-1353
VL - E95-C
IS - 11
JA - IEICE TRANSACTIONS on Electronics
Y1 - November 2012
AB - The copper nitride surface characteristics according to atmospheric pressure plasma (APP) and excimer ultraviolet (EUV) treatment were compared using XPS and AFM. As the result of XPS analysis result, in C1s, the organic material removal effect was greater for EUV treatment than for APP, and the oxygen content was found to be low. In Cu (933 eV) area, the shoulder peak of Cu compound was detected, and the reduction was greater for EUV processing than for APP. In the AFM phase image which could be analyzed using the superficial viscoelasticity, the same trend was observed. On the copper nitride surface, the weak boundary O layer is formed according to the clean processing, and such phenomenon was interpreted as a factor for lowering the affinity with polymer.
ER -
English
