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Low-Temperature Activation in Boron Ion-Implanted Silicon by Soft X-Ray Irradiation

Akira HEYA, Naoto MATSUO, Kazuhiro KANDA

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Summary :

A novel activation method for a B dopant implanted in a Si substrate using a soft X-ray undulator was examined. As the photon energy of the irradiated soft X-ray approached the energy of the core level of Si 2p, the activation ratio increased. The effect of soft X-ray irradiation on B activation was remarkable at temperatures lower than 400°C. The activation energy of B activation by soft X-ray irradiation (0.06 eV) was lower than that of B activation by furnace annealing (0.18 eV). The activation of the B dopant by soft X-ray irradiation occurs at low temperature, although the activation ratio shows small values of 6.2×10-3 at 110°C. The activation by soft X-ray is caused not only by thermal effects, but also electron excitation and atomic movement.

Publication
IEICE TRANSACTIONS on Electronics Vol.E99-C No.4 pp.474-480
Publication Date
2016/04/01
Publicized
Online ISSN
1745-1353
DOI
10.1587/transele.E99.C.474
Type of Manuscript
PAPER
Category
Semiconductor Materials and Devices

Authors

Akira HEYA
  University of Hyogo
Naoto MATSUO
  University of Hyogo
Kazuhiro KANDA
  University of Hyogo

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