A HfO2 as the charge-storage layer with the physical thickness thinner than 4 nm in silicon-oxide-high-k oxide-oxide-silicon (SOHOS) flash memory was investigated. Compared to the conventional silicon-oxide-nitride-oxide-silicon (SONOS) flash memory, the SOHOS shows the slow operational speed and exhibits the poorer retention characteristics. These are attributed to the thin physical thickness below 4 nm and the crystallization of the HfO2 to contribute the lateral migration of the trapped charge in the trapping layer during high temperature annealing process.

We report on the fabrication of coplanar dual-gate ZnO thin-film transistors with 200-nm thickness SiNx for both top and bottom dielectrics. The ZnO film was deposited by RF magnetron sputtering on SiO2/Si substrates at 100. And the thickness of ZnO film is compared with 100-nm and 40-nm. This TFT has a channel width of 100-µm and channel length of 5-µm. The fabricated coplanar dual-gate ZnO TFTs of 40-nm-thickness exhibits a field effect mobility of about 0.29 cm2/V s, a subthreshold swing 420 mV/decade, an on-off ratio 2.7107, and a threshold voltage 0.9 V, which are greatly improved characteristics, compared with conventional bottom-gate ZnO TFTs.