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[Author] Kunihiro FUJIYOSHI(8hit)

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  • The O-Sequence:Representation of 3D-Dissection

    Hidenori OHTA  Toshinori YAMADA  Chikaaki KODAMA  Kunihiro FUJIYOSHI  

     
    PAPER-Algorithms and Data Structures

      Vol:
    E91-A No:8
      Page(s):
    2111-2119

    A 3D-dissection (A rectangular solid dissection) is a dissection of a rectangular solid into smaller rectangular solids by planes. In this paper, we propose an O-sequence, a string of representing any 3D-dissection which is dissected by only non-crossing rectangular planes. We also present a necessary and sufficient condition for a given string to be an O-sequence.

  • Placement with Symmetry Constraints for Analog IC Layout Design Based on Tree Representation

    Natsumi HIRAKAWA  Kunihiro FUJIYOSHI  

     
    PAPER-VLSI Design Technology and CAD

      Vol:
    E92-A No:2
      Page(s):
    467-474

    Symmetry constrains are the constraints that the given cells should be placed symmetrically in design of analog ICs. We use O-tree to represent placements and propose a decoding algorithm which can obtain one of the minimum placements satisfying the constraints. The decoding algorithm uses linear programming, which is too much time consuming. Therefore we propose a graph based method to recognize if there exists no placement satisfying both the given symmetry and O-tree constraints, and use the method before application of linear programming. The effectiveness of the proposed method was shown by computational experiments.

  • A Method of Analog IC Placement with Common Centroid Constraints

    Keitaro UE  Kunihiro FUJIYOSHI  

     
    PAPER-VLSI Design Technology and CAD

      Vol:
    E97-A No:1
      Page(s):
    339-346

    To improve immunity against process gradients, a common centroid constraint, in which every pair of capacitors should be placed symmetrically with respect to a common center point, is widely used. The pair of capacitors are derived by dividing some original capacitors into two halves. Xiao et al. proposed a method to obtain a placement which satisfies the common centroid constraints, but this method has a defect. In this paper, we propose a decoding algorithm to obtain a placement which satisfies common centroid constraints.

  • A Graph Based Soft Module Handling in Floorplan

    Hiroaki ITOGA  Chikaaki KODAMA  Kunihiro FUJIYOSHI  

     
    PAPER-Floorplan and Placement

      Vol:
    E88-A No:12
      Page(s):
    3390-3397

    In the VLSI layout design, a floorplan is often obtained to define rough arrangement of modules in the early design stage. In the stage, the aspect ratio of each soft module is also determined. The aspect ratio can be changed in the designated range keeping its area of each module. In this paper, in order to determine the aspect ratio, we propose a graph-based one dimensional compaction method which determines the aspect ratio quickly under the constraint that topology of a floorplan must not be changed. The proposed method is divided into two steps: (1) Selection of a minimal set of soft modules to adjust the aspect ratio. (2) Decision on the aspect ratio. (1) is formulated as the minimal cut problem in graph theory. We solve the problem by transforming it to the shortest path problem. (2) is divided into two operations. One is to determine the increment limit in height or width of each soft module and the other is to determine the aspect ratio of each soft module by Newton-Raphson method. The experimental comparisons show effectiveness of the proposed method.

  • An Improved Method of Convex Rectilinear Block Packing Based on Sequence-Pair

    Kazuya WAKATA  Hiroaki SAITO  Kunihiro FUJIYOSHI  Keishi SAKANUSHI  Takayuki OBATA  Chikaaki KODAMA  

     
    PAPER-Place and Routing

      Vol:
    E86-A No:12
      Page(s):
    3148-3157

    In this paper, for convex rectilinear block packing problem, we propose 1) a novel algorithm to obtain a packing based on a given sequence-pair in O(n2) time (conventional method needs O(n3) time), where n is the number of rectangle sub-blocks made from convex blocks, 2) a move operation for Simulated Annealing which is symmetric and can guarantee reachability for the first time, and 3) a method to generate a random adjacent sequence-pair in O(n2) time. By using 1), 2) and 3) together, the time complexity of the inner loop in Simulated Annealing becomes surely O(n2) time. Experimental results show that the proposed algorithm is faster than the conventional ones in practical and the wire length as well as packing area is taken into consideration in the proposed method.

  • An Efficient Decoding Method of Sequence-Pair with Reduced Redundancy

    Chikaaki KODAMA  Kunihiro FUJIYOSHI  

     
    PAPER-Physical Design

      Vol:
    E85-A No:12
      Page(s):
    2785-2794

    The sequence-pair was proposed as a representation method of block placement to determine the densest possible placement of rectangular modules in VLSI layout design. A method of achieving bottom left corner packing in O(n2) time based on a given sequence-pair of n rectangles was proposed using horizontal/vertical constraint graphs. Also, a method of determining packing from a sequence-pair in O(n log n) time was proposed. Another method of obtaining packing in O(n log log n) time was recently proposed, but further improvement was still required. In this paper, we propose a method of obtaining packing via the Q-sequence (representation of rectangular dissection) in O(n+k) time from a given sequence-pair of n rectangles with k subsequences called adjacent crosses, given the position of adjacent crosses and the insertion order of dummy modules into adjacent crosses. The position of adjacent crosses and insertion order of dummy modules can be obtained from a sequence-pair in O(n+k) time using the conventional method. Here, we prove that arbitrary packing can be represented by a sequence-pair, keeping the value of k not more than n-3. Therefore, we can determine packing from a sequence-pair with k of O(n) in linear time using the proposed method and the conventional method.

  • Photo-Diode Array Partitioning Problem for a Rectangular Region

    Kunihiro FUJIYOSHI  Takahisa IMANO  

     
    PAPER

      Vol:
    E100-A No:12
      Page(s):
    2851-2856

    Photo Diode Array (PDA) is the key semiconductor component expected to produce specified output voltage in photo couplers and photo sensors when the light is on. PDA partitioning problem, which is to design PDA, is: Given die area, anode and cathode points, divide the area into N cells, with identical areas, connected in series from anode to cathode. In this paper, we first make restrictions for the problem and reveal the underlying properties of necessary and sufficient conditions for the existence of solutions when the restrictions are satisfied. Then, we propose a method to solve the problem using recursive algorithm, which can be guaranteed to obtain a solution in polynomial time.

  • Minimizing the Number of Empty Rooms on Floorplan by Dissection Line Merge

    Chikaaki KODAMA  Kunihiro FUJIYOSHI  

     
    PAPER-Programmable Logic, VLSI, CAD and Layout

      Vol:
    E88-D No:7
      Page(s):
    1389-1396

    This paper discusses how to minimize the number of dissection lines regarded as wiring channels on a floorplan corresponding to a placement of n modules. In a floorplan (rectangular dissection), the number of dissection lines exceeds the number of rooms exactly by three. Since a floorplan obtained from a given module placement may have many empty rooms where no module is assigned, redundant wiring channels and wire bends may also be generated. Hence, in order to reduce redundant channels and wire bends, removal of empty rooms is required. For this purpose, we formulate a problem of obtaining a floorplan with the minimum possible empty rooms based on a given module placement. Then, we propose a method of removing as many redundant empty rooms as possible by merging dissection lines on a floorplan in O(n) time. The number of empty rooms in the resultant floorplan is reduced to n- or less.