The dielectric breakdown strength of thermally grown silicon dioxide films was studied for MOS capacitors fabricated on silicon wafers that were intentionally contaminated with magnesium and zinc. Most of magnesium was detected in the oxide film after oxidation. Zinc, some of which evaporated from the surface of wafers, was detected only in the oxide film. The mechanism of the dielectric degradation is dominated by formation of metal silicates, such as Mg2SiO4 (Forsterite) and Zn2SiO4 (Wilemite). The formation of metal silicates has no influence on the generation lifetime of minority carriers, however, it provides the flat-band voltage shift less than 0.3 eV, and forces to increase the density of deep surface states with the zinc contamination.

The buried oxide nonintegrities, represented as the equivalent fixed oxide charge and interface trap densities at both the upper and lower interface of buried oxide, are evaluated for low-dose and high-dose SIMOX wafers, and their effects on device characteristics are investigated. The equivalent fixied oxide charge and trap densities at the lower interface, which are measured with buried oxide capacitors, are negligibly small in as-fabricated SIMOX wafers. This result enables us to make an analytical model of the parasitic drain/source-to-substrate capacitance in an SOI MOSFET, in which the effect of the depletion layer under the buried oxide is considered. The influence of thinner buried oxide and process-induced fixed oxide charge on the parasitic capacitance is explored with this model. The equivalent fixed oxide charge and trap densities at the upper interface are evaluated by the threshold voltage measurement in an SOI NMOSFET. The principle of this evaluation as well as the experimental technique are described in detail. The oxide charge and trap densities at the upper interface are higher than those at the lower interface for both SIMOX wafers. With a new model of the subthreshold slope based on a two-dimensional potential analysis the influence of the trap at the upper interface is discussed.