This paper demonstrates the resonant power supply noise reduction effects of STO thin film decoupling capacitors, which are embedded in interposers. The on-interposer STO capacitor consists of SrTiO2 whose dielectric constant is about 20 and is sandwitched by Cu films in an interposer. The on-interposer STO capacitors are directly connected to the LSI PADs so that they provide large decoupling capacitance without package leadframe/bonding wire inductance, resulting in the reduction of the resonant power supply noise. The measured power supply waveforms show significant reduction of the power supply noise, and the Shmoo plots also show the contribution of the STO capacitors to the robust operations of LSIs.

This paper proposes a triangular active charge injection method to reduce resonant power supply noise by injecting the adequate amount of charge into the supply line of the LSI in response to the current consumption of the core circuit. The proposed circuit is composed of three key components, a voltage drop detector, an injection controller circuit and a canceling capacitor circuit. In addition to the theoretical analysis of the proposed method, the measurement results indicate that our proposed method with active capacitor can realize about 14% noise reduction compared with the original noise amplitude. The proposed circuit consumes 25.2 mW in steady state and occupies 0.182 mm2.