The degradation of I-V characteristics under constant emitter-base reverse voltage stress in advanced self-aligned bipolar transistors was analyzed. Experimental analyses have been taken the stress field effect into account when predicting hot-carrier degradation. These analyses showed that base current starts to increase when the reverse voltage stress is about 3 V. The dependence of the base current change on reverse voltages of more than 3 V was also investigated experimentally, and equations expressing hot-carrier degradation in terms of the exponential dependence of excess base current on both reverse stress voltage and stress-enhancing voltage related to emitter-base breakdown voltage were derived.

A selectively grown Si1-xGex base heterojunction bipolar transistor (HBT) was fabricated, and effects of Ge and B profiles on the device performance were investigated. Since no obvious leakage current was observed, it is shown that good crystallinity of Si1-xGex was achieved by using a UHV/CVD system with high-pressure H2 pre-cleaning of the substrate. Very high current gain of 29,000 was obtained in an HBT with a uniform Ge profile by both increasing electron injection from the emitter to the base and reducing band gap energy in the base. Since the Early voltage is affected by the grading of Ge content in the base, the HBT with the graded Ge profile provides very high Early voltage. However, the breakdown voltage is degraded by increasing Ge content because of reducing bandgap energy and changing dopant profile. To increase the cutoff frequency, dopant diffusion must be suppressed, and carrier acceleration by the internal drift field with the graded Ge profile has an additional effect. By doing them, an extremely high cutoff frequency of 130 GHz was obtained in HBT with graded Ge profiles.

A high-frequency, low-noise silicon bipolar transistor that can be used in over-10 Gb/s optical communication systems and wireless communication systems has been developed. The silicon bipolar transistor was fabricated using self-aligned metal/IDP (SMI) technology, which produces a self-aligned base electrode of stacked layers of metal and in-situ doped poly-Si (IDP) by low-temperature selective tungsten CVD. It provides a low base resistance and high-cutoff frequency. The base resistance is reduced to half that of a transistor with a conventional poly-Si base electrode. By using the SMI technology and optimizing the depth of the emitter and the link base, we achieved the maximum oscillation frequency of 80 GHz, a minimum gate delay in an ECL of 11.6 ps, and the minimum noise figure of 0.34 dB at 2 GHz, which are the highest performances among those obtained from ion-implanted base Si bipolar transistors, and are comparable to those of SiGe base heterojunction bipolar transistors.

A simplified distribution base resistance model (SDM) is proposed to identify each component of the base resistance and determine the dominant. This model divides the parasitic base resistance into one straight path and two surrounding paths. It is clarified that the link base resistance is dominant in a short emitter and the surrounding polysilicon base electrode resistance is dominant in a long emitter. In the SDM, the distance of the link base is reduced to half; with metal silicide as the extrinsic base electrode, the base resistance will be reduced to 75%.