Surface-channel PMOSFETs are suitable for use in the quarter micron CMOS devices. For surface-channel PMOSFETs with p+ poly-Si gates, boron penetration and hot-carrier effects were investigated. When the annealing temperature is higher and the gate oxide is thinner, a larger threshold voltage shift was observed for p+ poly-Si PMOSFETs, because of boron penetration. Furthermore, PMOSFETs with BF2-implanted gates cause larger boron penetration than those with Boron-implanted gates. Howerer, the PMOSFET lifetime, determined by hot-carrier reliability, does not depend on the degree of boron penetration. Instead, it depends on doping species, that is, BF2 and Boron. PMOSFETs with BF2-implanted gates have about 100 times longer lifetime than those with Boron-implanted gates. The main reason for the longer lifetime of BF2-doped PMOSFETs is the incorporation of fluorine in the gate oxide of the PMOSFET with the BF2-implanted gate, resulting in the smaller electron trapping in the gate oxide. The maximun allowed supply voltage,based on the hot-carrier reliability, is higher than4V for sub-half micron PMOSFETs with BF2- or Boron-implanted poly Si gates.

0.15 µm CMOS transistors have been fabricated. TiSi2 salicide was used for the gate electrode and source/drain to reduce parasitic resistance. Electron beam (EB) lithography was used for the gate patterning. Since the channel impurity was implanted only around the gate to reduce the junction capacitance, a reasonably short ring oscillator delay of 33 ps was obtained at 1.9 V supply voltage. The parasitic resistance and capacitance contribution on the delay time was analyzed by SPICE simulation. It was shown that the localized channel implant is effective for scaling the delay time and power consumption, because the source/drain size difficult to scale down to as small as the gate length.