This paper describes packaging techniques based on a novel passive alignment technique as key techniques for module assembly. A laser diode (LD) is passively positioned by detecting a pair of alignment marks located on the LD and Si substrate. A single-mode fiber is self aligned on a Si V groove. A simple receptacle structure for the module output port is also newly designed. This structure is more suitable for the automatic assembly line as well as the module mounting process on circuit board. In this paper, an advanced module applications such as a hybrid integrated wave guide module and a surface mountable (SMT) LD module is introduced.

White-light emitting diode lamps for general illumination can be realized by a combination of a blue light-emitting diode semiconductor die and phosphors. Newly developed oxynitride and nitride phosphors are promising candidates for this application because they have suitable excitation and emission wavelengths and stable optical properties in a high temperature environment. High brightness warm-white LED lamps have been realized using a yellowish-orange α-SiAlON oxynitride phosphor. High color-rendering index white LED lamps have been also realized using three color oxynitride/nitride phosphors.