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Kazuhiko KURATA Kenji YAMAUCHI Atsuhiro KAWATANI Akio GOTO Naoki KIMURA Kimikazu HIGASHIKAWA Satoshi DOHMAE Hideki TANAKA Shigeta ISHIKAWA
This paper describes packaging techniques based on a novel passive alignment technique as key techniques for module assembly. A laser diode (LD) is passively positioned by detecting a pair of alignment marks located on the LD and Si substrate. A single-mode fiber is self aligned on a Si V groove. A simple receptacle structure for the module output port is also newly designed. This structure is more suitable for the automatic assembly line as well as the module mounting process on circuit board. In this paper, an advanced module applications such as a hybrid integrated wave guide module and a surface mountable (SMT) LD module is introduced.
Kazuhito FURUYA Shigeta ISHIKAWA Yasuharu SUEMATSU
Ultimate limit of the bandwidth of the multimode optical fiber with the index profile consisting of α-power and the fourth-order terms of radius is derived, rejecting the effects of the cladding and compensating the material dispersion. The 3 dB-bandwidth can be increased up to 1.9 GHz at 10 km length.