IEICE TRANSACTIONS on Electronics
Low Cost Optical Module Packaging Techniques for Optical Access Network Systems
Summary :
This paper describes packaging techniques based on a novel passive alignment technique as key techniques for module assembly. A laser diode (LD) is passively positioned by detecting a pair of alignment marks located on the LD and Si substrate. A single-mode fiber is self aligned on a Si V groove. A simple receptacle structure for the module output port is also newly designed. This structure is more suitable for the automatic assembly line as well as the module mounting process on circuit board. In this paper, an advanced module applications such as a hybrid integrated wave guide module and a surface mountable (SMT) LD module is introduced.
- Publication
- IEICE TRANSACTIONS on Electronics Vol.E80-C No.1 pp.98-106
- Publication Date
- 1997/01/25
- Publicized
- Online ISSN
- DOI
- Type of Manuscript
- Special Section PAPER (Special Issue on Devices, Packaging Technology, and Subsystems for the Optical Access Network)
- Category
Authors
Kazuhiko KURATA
Kenji YAMAUCHI
Atsuhiro KAWATANI
Akio GOTO
Naoki KIMURA
Kimikazu HIGASHIKAWA
Satoshi DOHMAE
Hideki TANAKA
Shigeta ISHIKAWA
Keyword
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Kazuhiko KURATA, Kenji YAMAUCHI, Atsuhiro KAWATANI, Akio GOTO, Naoki KIMURA, Kimikazu HIGASHIKAWA, Satoshi DOHMAE, Hideki TANAKA, Shigeta ISHIKAWA, "Low Cost Optical Module Packaging Techniques for Optical Access Network Systems" in IEICE TRANSACTIONS on Electronics,
vol. E80-C, no. 1, pp. 98-106, January 1997, doi: .
Abstract: This paper describes packaging techniques based on a novel passive alignment technique as key techniques for module assembly. A laser diode (LD) is passively positioned by detecting a pair of alignment marks located on the LD and Si substrate. A single-mode fiber is self aligned on a Si V groove. A simple receptacle structure for the module output port is also newly designed. This structure is more suitable for the automatic assembly line as well as the module mounting process on circuit board. In this paper, an advanced module applications such as a hybrid integrated wave guide module and a surface mountable (SMT) LD module is introduced.
URL: https://global.ieice.org/en_transactions/electronics/10.1587/e80-c_1_98/_p
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@ARTICLE{e80-c_1_98,
author={Kazuhiko KURATA, Kenji YAMAUCHI, Atsuhiro KAWATANI, Akio GOTO, Naoki KIMURA, Kimikazu HIGASHIKAWA, Satoshi DOHMAE, Hideki TANAKA, Shigeta ISHIKAWA, },
journal={IEICE TRANSACTIONS on Electronics},
title={Low Cost Optical Module Packaging Techniques for Optical Access Network Systems},
year={1997},
volume={E80-C},
number={1},
pages={98-106},
abstract={This paper describes packaging techniques based on a novel passive alignment technique as key techniques for module assembly. A laser diode (LD) is passively positioned by detecting a pair of alignment marks located on the LD and Si substrate. A single-mode fiber is self aligned on a Si V groove. A simple receptacle structure for the module output port is also newly designed. This structure is more suitable for the automatic assembly line as well as the module mounting process on circuit board. In this paper, an advanced module applications such as a hybrid integrated wave guide module and a surface mountable (SMT) LD module is introduced.},
keywords={},
doi={},
ISSN={},
month={January},}
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TY - JOUR
TI - Low Cost Optical Module Packaging Techniques for Optical Access Network Systems
T2 - IEICE TRANSACTIONS on Electronics
SP - 98
EP - 106
AU - Kazuhiko KURATA
AU - Kenji YAMAUCHI
AU - Atsuhiro KAWATANI
AU - Akio GOTO
AU - Naoki KIMURA
AU - Kimikazu HIGASHIKAWA
AU - Satoshi DOHMAE
AU - Hideki TANAKA
AU - Shigeta ISHIKAWA
PY - 1997
DO -
JO - IEICE TRANSACTIONS on Electronics
SN -
VL - E80-C
IS - 1
JA - IEICE TRANSACTIONS on Electronics
Y1 - January 1997
AB - This paper describes packaging techniques based on a novel passive alignment technique as key techniques for module assembly. A laser diode (LD) is passively positioned by detecting a pair of alignment marks located on the LD and Si substrate. A single-mode fiber is self aligned on a Si V groove. A simple receptacle structure for the module output port is also newly designed. This structure is more suitable for the automatic assembly line as well as the module mounting process on circuit board. In this paper, an advanced module applications such as a hybrid integrated wave guide module and a surface mountable (SMT) LD module is introduced.
ER -
English
