This paper describes a hybrid force-directed self-organizing neural network approach to printed circuit board (PCB) placement with consideration of electromagnetic compatibility (EMC). In most of the conventional PCB automatic placement algorithms, the only factor considered in the objective function is minimized total net length. However, for today's high speed and high density PCB, EMC compliance cannot be met by such single objective. To tackle this problem, the presented algorithm takes EMC into consideration, besides component overlap and minimized total net length. These factors are optimized by means of an adapted self-organizing map. Comparison of simulated placement results as well as actual measurements with commercial softwares confirms the effectiveness of the proposed method.

In this research, the performance degradation of the digital electronic equipment under electromagnetic (EM) disturbance was studied in order to investigate the interference of intra-equipment. To develop the evaluation method of the performance degradation, some communication indexes were measured under EM disturbance. From some experimental results, it is known that the performance degradation of the electronic equipment was estimated by the degradation of "through-put," one of the communication performance indexes. For further investigation of the interference of intra-equipment, the near EM field from a PCB of the electronic equipment and its performance degradation under EM disturbance were measured and compared. From the measured results, the relationship between near field measurement and performance degradation could be obtained in some extent. These facts enable us that the weak area under the EM disturbance application on PCB can be foreseen by measuring the near field emission from the equipment and vise versa.