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Eiji HIGURASHI Renshi SAWADA Tadatomo SUGA
This paper focuses on optical integration technology and its application in optical microsensors used in biomedical fields. The integration is based on the hybrid integration approach, achieving high performance, small size and weight, and lower cost. First, we describe the key technologies used in hybrid integration, namely passive alignment technology, low temperature bonding technology, and packaging technology for realizing advanced microsensors. Then, we describe an integrated laser Doppler flowmeter that can monitor blood flow in human skin.
Eiji HIGURASHI Michitaka YAMAMOTO Takeshi SATO Tadatomo SUGA Renshi SAWADA
Low-temperature bonding methods of optoelectronic chips, such as laser diodes (LD) and photodiode (PD) chips, have been the focus of much interest to develop highly functional and compact optoelectronic devices, such as microsensors and communication modules. In this paper, room-temperature bonding of the optoelectronic chips with Au thin film to coined Au stud bumps with smooth surfaces (Ra: 1.3nm) using argon and hydrogen gas mixture atmospheric-pressure plasma was demonstrated in ambient air. The die-shear strength was high enough to exceed the strength requirement of MIL-STD-883F, method 2019 (×2). The measured results of the light-current-voltage characteristics of the LD chips and the dark current-voltage characteristics of the PD chips indicated no degradation after bonding.