Drivability-improved MOSFETs were successfully fabricated by using nano-grating silicon wafers. There was almost no additional process change in device fabrication when the height of the gratings was less than the conventional macroscopic wafer surface roughness. The MOSFETs with the grating height of 35 nm showed 21% improvement in current drivability compared to the conventional one with the same device occupancy area. And the roll-off characteristic of threshold voltage of nano-grating device held the line of conventional one in despite of the 3-D channel structure. The technology provides great advantages for drivability improvement without paying much tradeoff of process cost. This proposal will be useful to CMOS-LSIs with high performance in general.

The structure of the nanograting channel MOSFET was optimized by simply rounding the corners of the nanogratings. The current drivabilities of the optimized nanograting channel MOSFETs were enhanced by about 20% and 50% for both n-channel and p-channel MOSFETs, respectively. The mobility changes were analyzed on the basis of channel stress as well as theoretical change of mobilities by various surface orientations. The internal compressive stress of 0.23% was measured in the channel. By suppressing the electric field increase at the corner edge of the nanograting channel to less than 10%, the fabricated rounded nanograting MOSFETs achieved lifetimes of NBTI and TDDB as long as those of conventional planar devices.