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Hiroyuki WADA Daesung LEE Stefan ZAPPE Uma KRISHNAMOORTHY Olav SOLGAARD
The lithography process on the deep trench pattern above the large cavity is proposed to fabricate the MEMS structure. Generally, bubbles generated on the trench patterns when it was baked after coating resist. The probability of the generation of bubbles was reduced by decreasing the backing rate. The fast scanning micromirror with 50.8 kHz resonant frequency was fabricated by controlling the backing rate.