Lithography Process for Trench Pattern above Large Cavity to Fabricate Fast Scanning Micromirror
Summary :
The lithography process on the deep trench pattern above the large cavity is proposed to fabricate the MEMS structure. Generally, bubbles generated on the trench patterns when it was baked after coating resist. The probability of the generation of bubbles was reduced by decreasing the backing rate. The fast scanning micromirror with 50.8 kHz resonant frequency was fabricated by controlling the backing rate.
- Publication
- IEICE TRANSACTIONS on Electronics Vol.E87-C No.8 pp.1395-1398
- Publication Date
- 2004/08/01
- Publicized
- Online ISSN
- DOI
- Type of Manuscript
- LETTER
- Category
- Electromechanical Devices and Components
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Hiroyuki WADA, Daesung LEE, Stefan ZAPPE, Uma KRISHNAMOORTHY, Olav SOLGAARD, "Lithography Process for Trench Pattern above Large Cavity to Fabricate Fast Scanning Micromirror" in IEICE TRANSACTIONS on Electronics,
vol. E87-C, no. 8, pp. 1395-1398, August 2004, doi: .
Abstract: The lithography process on the deep trench pattern above the large cavity is proposed to fabricate the MEMS structure. Generally, bubbles generated on the trench patterns when it was baked after coating resist. The probability of the generation of bubbles was reduced by decreasing the backing rate. The fast scanning micromirror with 50.8 kHz resonant frequency was fabricated by controlling the backing rate.
URL: https://global.ieice.org/en_transactions/electronics/10.1587/e87-c_8_1395/_p
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@ARTICLE{e87-c_8_1395,
author={Hiroyuki WADA, Daesung LEE, Stefan ZAPPE, Uma KRISHNAMOORTHY, Olav SOLGAARD, },
journal={IEICE TRANSACTIONS on Electronics},
title={Lithography Process for Trench Pattern above Large Cavity to Fabricate Fast Scanning Micromirror},
year={2004},
volume={E87-C},
number={8},
pages={1395-1398},
abstract={The lithography process on the deep trench pattern above the large cavity is proposed to fabricate the MEMS structure. Generally, bubbles generated on the trench patterns when it was baked after coating resist. The probability of the generation of bubbles was reduced by decreasing the backing rate. The fast scanning micromirror with 50.8 kHz resonant frequency was fabricated by controlling the backing rate.},
keywords={},
doi={},
ISSN={},
month={August},}
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TY - JOUR
TI - Lithography Process for Trench Pattern above Large Cavity to Fabricate Fast Scanning Micromirror
T2 - IEICE TRANSACTIONS on Electronics
SP - 1395
EP - 1398
AU - Hiroyuki WADA
AU - Daesung LEE
AU - Stefan ZAPPE
AU - Uma KRISHNAMOORTHY
AU - Olav SOLGAARD
PY - 2004
DO -
JO - IEICE TRANSACTIONS on Electronics
SN -
VL - E87-C
IS - 8
JA - IEICE TRANSACTIONS on Electronics
Y1 - August 2004
AB - The lithography process on the deep trench pattern above the large cavity is proposed to fabricate the MEMS structure. Generally, bubbles generated on the trench patterns when it was baked after coating resist. The probability of the generation of bubbles was reduced by decreasing the backing rate. The fast scanning micromirror with 50.8 kHz resonant frequency was fabricated by controlling the backing rate.
ER -
English
