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Osamu NISHII Yoichi YUYAMA Masayuki ITO Yoshikazu KIYOSHIGE Yusuke NITTA Makoto ISHIKAWA Tetsuya YAMADA Junichi MIYAKOSHI Yasutaka WADA Keiji KIMURA Hironori KASAHARA Hideo MAEJIMA
We built a 12.4 mm12.4 mm, 45-nm CMOS, chip that integrates eight 648-MHz general purpose cores, two matrix processor (MX-2) cores, four flexible engine (FE) cores and media IP (VPU5) to establish heterogeneous multi-core chip architecture. The general purpose core had its IPC (instructions per cycle) performance enhanced by adding 32-bit instructions to the existing 16-bit fixed-length instruction set and executing up to two 32-bit instructions per cycle. Considering these five-to-seven years of embedded LSI and increasing trend of access-master within LSI, we predict that the memory usage of single core will not exceed 32-bit physical area (i.e. 4 GB), but chip-total memory usage will exceed 4 GB. Based on this prediction, the physical address was expanded from 32-bit to 40-bit. The fabricated chip was tested and a parallel operation of eight general purpose cores and four FE cores and eight data transfer units (DTU) is obtained on AAC (Advanced Audio Coding) encode processing.
Tetsuya YAMADA Masahide ABE Yusuke NITTA Kenji OGURA Manabu KUSAOKE Makoto ISHIKAWA Motokazu OZAWA Kiwamu TAKADA Fumio ARAKAWA Osamu NISHII Toshihiro HATTORI
A low-power SuperHTM embedded processor core, the SH-X2, has been designed in 90-nm CMOS technology. The power consumption was reduced by using hierarchical fine-grained clock gating to reduce the power consumption of the flip-flops and the clock-tree, synthesis and a layout that supports the implementation of the clock gating, and several-level power evaluations for RTL refinement. With this clock gating and RTL refinement, the power consumption of the clock-tree and flip-flops was reduced by 35% and 59%, including the process shrinking effects, respectively. As a result, the SH-X2 achieved 6,000 MIPS/W using a Renesas low-power process with a lowered voltage. Its performance-power efficiency was 25% better than that of a 130-nm-process SH-X.