The objective, when mapping a wafer, is to capture the the full variation across the wafer while minimising the number of measurements. This is a very similar objective to that of experimental design and this paper applies classical Design Of Experiment (DOE) techniques to the selection of measurement points for wafer mapping. The resulting measurements are then fitted using Response Surface Methodology (RSM) from which contour plots or wafer maps can be generated. The accuracy of the fit can be ascertained by inspection of the adjusted R2 value and it is demonstrated that in many cases transformations can be used to improve the accuracy of the resulting wafer maps.

The locally exhaustive testing of multiple output combinational circuits is the test which provides exhaustive test patterns for each set of inputs on which each output depends. First, this paper presents a sufficient condition under which a minimum test set (MLTS) for the locally exhaustive testing has 2w test patterns, where w is the maximum number of inputs on which any output depends. Next, we clarify that any CUT with up to four outputs satisfies the condition, independently of w and n, where n is the number of inputs of the CUT. Finally, we clarify that any CUT with five outputs also satisfies the condition for 1w2 or n2wn.