This paper proposes a method for testing delay faults using a boundary scan circuit in which a time-to-digital converter (TDC) is embedded. The incoming transitions from the other cores or chips are captured at the boundary scan circuit. The TDC circuit is modified to set the initial value for a delay line through which the transition is propagated. The condition for measuring timing slacks of two or more paths is also investigated since the overlap of the signals may occur in the delay line of the TDC in our boundary scan circuit. An experimental IC with the TDC and boundary scan is fabricated and is measured to estimate the delay of some paths measured by the TDC embedded in boundary scan cells. The simulation results for a benchmark circuit with the boundary scan circuit are also shown for the case that timing slacks of multiple paths can be observed even if the signals overlap in the TDC.

This paper proposes a novel boundary scan test scheme for intellectual property (IP) core identification via watermarking. The core concept is embedding a watermark identification circuit (WIC) and a test circuit into the IP core at the behavior design level. The procedure depends on current IP-based design flow. This scheme can detect the identification of the IP provider without the need to examine the microphotograph after the chip has been manufactured and packaged. This scheme can successfully survive synthesis, placement, and routing and identify the IP core at various design levels. Experimental results have demonstrated that the proposed approach has the potential to solve the IP identification problem.

It is important to test the various kinds of interconnect faults between chips on a card/module. When boundary scan design techniques are adopted, the chip to chip interconnection test generation and application of test patterns is greatly simplified. Various test generation algorithms have been developed for interconnect faults. A new interconnect test generation algorithm is introduced. It reduces the number of test patterns by half over present techniques. It also guarantees the complete diagnosis of multiple interconnect faults.