LSI on-chip optical interconnections are discussed from the viewpoint of a comparison between optical and electrical interconnections. Based on a practical prediction of our optical device development, optical interconnects will have an advantage over electrical interconnects within a chip that has an interconnect length less than about 10 mm at the hp32-22 nm technology node. Fundamental optical devices and components used in interconnections have also been introduced that are small enough to be placed on top of a Si LSI and that can be fabricated using methods compatible with CMOS processes. A SiON waveguide showed a low propagation loss around 0.3 dB/cm at a wavelength of 850 nm, and excellent branching characteristics were achieved for MMI (multimode interference) branch structures. A Si nano-photodiode showed highly enhanced speed and efficiency with a surface plasmon antenna. By combining our Si nano-photonic devices with the advanced TIA-less optical clock distribution circuits, clock distribution above 10 GHz can be achieved with a small footprint on an LSI chip.

This paper was written for LSI engineers in order to demonstrate the effect of optical interconnections in LSIs to improve both the speed and power performances of 0.5 and 0.2 µm CMOS microprocessors. The feasibilities and problems regarding new micronsize optoelectronic devices as well as associated electronics are discussed. Actual circuit structures clocks and bus lines used for optical interconnection are discussed. Newly designed optical interconnections and the speed power performances are compared with those of the original electrical interconnection systems.