This paper presents the dynamics of heavy-ion induced latchup turn-on behavior in CMOS structures using a three-dimensional and transient device simulation. The three-dimensional effects of parasitic devices in a CMOS structure during latchup turn-on are discussed in detail when a heavy-ion strikes the CMOS structure. For different incident types, the dynamics of latchup turn-on behaviors are also simulated. Moreover, latchup immunities of the CMOS structure obtained by two- and three-dimensional calculations are compared for the different incident types. This result suggests that the rough relation between latchup immunity and heavy-ion incident energy can be estimated using a two-dimensional simulation.