Design approach to improving fmax of InP-based HBTs by combining lateral scaling (lithographic scaling) and vertical scaling (improving fT) is discussed. An HBT scaling model is formulated to provide means of analyzing the essential impact of scaling on fmax. The model was compared with measurements of single and double heterojunction bipolar transistors with different fT and various emitter sizes. While a high fmax of 313 GHz was achieved using submicron HBT with high fT, it was found that further improvement could have been obtained by reducing the emitter resistance, which has imposed considerable limit on lateral scaling.

This paper reports on a high-speed silicon bipolar transistor with an fT and fMAX of over 40 GHz, we call it the Advanced Boro-silicated-glass Self-Aligned (A-BSA) transistor. In basic BSA technology, a CVD-BSG film is used not only as a diffusion source to form the intrinsic base and the link base regions but also as a sidewall spacer between the emitter and the base polysilicon electrodes. An A-BSA transistor offers three advancements to this technology: (1) a graded collector profile underneath the intrinsic base region to suppress the Kirk effect; (2) an optimized design of the link base region to prevent the frade-off effect between fT and base resistance; and (3) a newly developed buried emitter electrode structure, consisting of an N++-polysilicon layer, a platinum silicide layer, and a CVD tungsten plug, to prevent the emitter plug effect. Furthermore, our transistor uses a BPSG filled trench isolation to reduce parasitic capacitance and improve circuit performance. In this paper, we describe device design, process technology and characterization of the A-BSA transistor, with it we have performed several application ICs, operating at 10Gb/s and above. The A-BSA transistor achieved an fT of 41 GHz and an fMAX of 44 GHz under optimized conditions.