We report on a novel micromechanical photonic integrated circuits (PIC) for integrating free-space optical systems on a chip. Using polysilicon surface-micromachining technique, micro-optical elements, three-dimensional optomechanical structures, and microactuators are monolithically integrated on silicon substrate. We will discuss the basic building blocks of the micromechanical PIC, including XYZ micropositioners, 2-axis tilting micromirrors, scanning microlenses, and their integration with vertical cavity surface-emitting lasers. We will also discuss their applications in reconfigurable optical interconnect and active alignment in parallel free-space optical interconnect systems.

The growing availability of commercial foundry processes allows easy implementation of micro-opto-electro-mechanical systems (MOEMS) for a variety of applications. Such applications go beyond single devices to include whole optical systems on a chip, consisting of mirrors, gratings, Fresnel lenses and shutters, for example. Hinged and rotating structures, combined with powerful and compact thermal actuators, provide the means for positioning and operating these optical components. This paper presents examples of such systems built in a commercial polycrystalline silicon surface-micromachining process, the ARPA-sponsored Multi-User MEMS ProcesS (MUMPS). Examples range from optical sub-components to large mirror arrays, communication components, and micro-interferometers. Using the examples discussed in this paper, a designer can take advantage of commercially available surface-micromachining processes to design and develop MOEMS without the need for extensive in-house micromachining capabilities.