Micromechanical Photonic Integrated Circuits
Summary :
We report on a novel micromechanical photonic integrated circuits (PIC) for integrating free-space optical systems on a chip. Using polysilicon surface-micromachining technique, micro-optical elements, three-dimensional optomechanical structures, and microactuators are monolithically integrated on silicon substrate. We will discuss the basic building blocks of the micromechanical PIC, including XYZ micropositioners, 2-axis tilting micromirrors, scanning microlenses, and their integration with vertical cavity surface-emitting lasers. We will also discuss their applications in reconfigurable optical interconnect and active alignment in parallel free-space optical interconnect systems.
- Publication
- IEICE TRANSACTIONS on Electronics Vol.E83-C No.6 pp.903-911
- Publication Date
- 2000/06/25
- Publicized
- Online ISSN
- DOI
- Type of Manuscript
- Special Section INVITED PAPER (Special Issue on Advanced Optical Devices for Next Generation High-Speed Communication Systems and Photonic Networks)
- Category
- Switches and Novel Devices
Authors
Keyword
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Ming C. WU, Li FAN, Guo-Dong SU, "Micromechanical Photonic Integrated Circuits" in IEICE TRANSACTIONS on Electronics,
vol. E83-C, no. 6, pp. 903-911, June 2000, doi: .
Abstract: We report on a novel micromechanical photonic integrated circuits (PIC) for integrating free-space optical systems on a chip. Using polysilicon surface-micromachining technique, micro-optical elements, three-dimensional optomechanical structures, and microactuators are monolithically integrated on silicon substrate. We will discuss the basic building blocks of the micromechanical PIC, including XYZ micropositioners, 2-axis tilting micromirrors, scanning microlenses, and their integration with vertical cavity surface-emitting lasers. We will also discuss their applications in reconfigurable optical interconnect and active alignment in parallel free-space optical interconnect systems.
URL: https://global.ieice.org/en_transactions/electronics/10.1587/e83-c_6_903/_p
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@ARTICLE{e83-c_6_903,
author={Ming C. WU, Li FAN, Guo-Dong SU, },
journal={IEICE TRANSACTIONS on Electronics},
title={Micromechanical Photonic Integrated Circuits},
year={2000},
volume={E83-C},
number={6},
pages={903-911},
abstract={We report on a novel micromechanical photonic integrated circuits (PIC) for integrating free-space optical systems on a chip. Using polysilicon surface-micromachining technique, micro-optical elements, three-dimensional optomechanical structures, and microactuators are monolithically integrated on silicon substrate. We will discuss the basic building blocks of the micromechanical PIC, including XYZ micropositioners, 2-axis tilting micromirrors, scanning microlenses, and their integration with vertical cavity surface-emitting lasers. We will also discuss their applications in reconfigurable optical interconnect and active alignment in parallel free-space optical interconnect systems.},
keywords={},
doi={},
ISSN={},
month={June},}
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TY - JOUR
TI - Micromechanical Photonic Integrated Circuits
T2 - IEICE TRANSACTIONS on Electronics
SP - 903
EP - 911
AU - Ming C. WU
AU - Li FAN
AU - Guo-Dong SU
PY - 2000
DO -
JO - IEICE TRANSACTIONS on Electronics
SN -
VL - E83-C
IS - 6
JA - IEICE TRANSACTIONS on Electronics
Y1 - June 2000
AB - We report on a novel micromechanical photonic integrated circuits (PIC) for integrating free-space optical systems on a chip. Using polysilicon surface-micromachining technique, micro-optical elements, three-dimensional optomechanical structures, and microactuators are monolithically integrated on silicon substrate. We will discuss the basic building blocks of the micromechanical PIC, including XYZ micropositioners, 2-axis tilting micromirrors, scanning microlenses, and their integration with vertical cavity surface-emitting lasers. We will also discuss their applications in reconfigurable optical interconnect and active alignment in parallel free-space optical interconnect systems.
ER -
English
