To completely utilize the advantages of dynamic voltage and frequency scaling (DVFS) techniques, a quantized decoder (QNT-D) was developed. The QNT-D generates a quantized signal processing quantity (Q) using a predicted signal processing quantity (M). Q is used to produce the optimum frequency (opt.fc) and the optimum supply voltage (opt.VD) that are proportional to Q. To develop a DVFS controlled motion estimation (ME) processor, we used both the QNT-D and a fast ME algorithm called A2BC (Adaptively Assigned Breaking-off Condition) to predict M for each macro-block (MB). A DVFS controlled ME processor was fabricated using 90-nm CMOS technology. The total power dissipation (PT) of the processor was significantly reduced and varied from 38.65 to 99.5 µW, only 3.27 to 8.41 % of PT of a conventional ME processor, depending on the test video picture.

In this paper, a hamburger architecture with a 3D stacked reconfigurable memory is proposed for a 4K motion estimation (ME) processor. By positioning the memory dies on both the top and bottom sides of the processor die, the proposed hamburger architecture can reduce the usage of the signal through-silicon via (TSV), and balance the power delivery network and the clock tree of the entire system. It results in 1/3 reduction of the usage of signal TSVs. Moreover, a stacked reconfigurable memory architecture is proposed to reduce the fabrication complexity and further reduce the number of signal TSVs by more than 1/2. The reduction of signal TSVs in the entire design is 71.24%. Finally, we address unique issues that occur in electronic design automation (EDA) tools during 3D large-scale integration (LSI) designs. As a result, a 4K ME processor with 7-die stacking 3D system-on-chip design is implemented. The proposed design can support real time 3840 × 2160 @ 120 fps encoding at 130 MHz with less than 540 mW.

Motion estimation (ME) is a key encoding component of almost all modern video coding standards. ME contributes significantly to video coding efficiency, but, it also consumes the most power of any component in a video encoder. In this paper, an ME processor with 3D stacked memory architecture is proposed to reduce memory and core power consumption. First, a memory die is designed and stacked with ME die. By adding face-to-face (F2F) pads and through-silicon-via (TSV) definitions, 2D electronic design automation (EDA) tools can be extended to support the proposed 3D stacking architecture. Moreover, a special memory controller is applied to control data transmission and timing between the memory die and the ME processor die. Finally, a 3D physical design is completed for the entire system. This design includes TSV/F2F placement, floor plan optimization, and power network generation. Compared to 2D technology, the number of input/output (IO) pins is reduced by 77%. After optimizing the floor plan of the processor die and memory die, the routing wire lengths are reduced by 13.4% and 50%, respectively. The stacking static random access memory contributes the most power reduction in this work. The simulation results show that the design can support real-time 720p @ 60fps encoding at 8MHz using less than 65mW in power, which is much better compared to the state-of-the-art ME processor.

This paper describes an ultra low power, motion estimation (ME) processor for MPEG2 HDTV resolution video. It adopts a Gradient Descent Search (GDS) algorithm that drastically reduces required computational power to 6 GOPS. A SIMD datapath architecture optimized for the GDS algorithm decreases the clock frequency and operating voltage. A low power 3-port SRAM with a write-disturb-free cell array arrangement is newly designed for image data caches of the processor. The proposed ME processor contains 7-M transistors, integrated in 4.50 mm 3.35 mm area using 0.13 µm CMOS technology. Estimated power consumption is less than 100 mW at 81 MHz@1.0 V. The processor is applicable to a portable HDTV system.