We show that imperfection in an IQ-modulator degrades the accuracy of the auto bias control (ABC) circuit connected to the modulator's complementary port. Theoretical analyses show that the IQ-modulator constructed by a nested Mach-Zehnder modulator with a low extinction ratio can distort a constellation of modulated light observed at the complementary port. We propose an auto calibration technique for the ABC circuit that can effectively suppress this degradation. Experimental results using 32-Gbaud, 16-QAM signals showed the measured Q-factor improved by 0.5dB with our proposed technique.

This paper describes the design and experiment results of a 25Gbps vertical-cavity surface emitting laser (VCSEL) driver circuit for a multi channel optical transmitter. To compensate for the non-linearity of the VCSEL and achieve high speed data rate communication, an asymmetric pre-emphasis technique is proposed for the VCSEL driver. An asymmetric pre-emphasis signal can be created by adjusting the duty ratio of the emphasis signal. The VCSEL driver adopts a double cascode connection that can apply a drive current from a high voltage DC bias and feed-forward compensation that can enhance the band-width for common-cathode VCSEL. For the design of the optical module structure, a two-tier low temperature co-fired ceramics (LTCC) package is adopted to minimize the wire bonding between the signal pad on the LTCC and the anode pad on the VCSEL. This structure and circuit reduces the simulated deterministic jitter from 12.7 to 4.1ps. A test chip was fabricated with the 65-nm standard CMOS process and demonstrated to work as an optical transmitter. An experimental evaluation showed that this VCSEL driver with asymmetric pre-emphasis reduced the total deterministic jitter up to 8.6ps and improved the vertical eye opening ratio by 3% compared with symmetric pre-emphasis at 25Gbps with a PRBS=29-1 test signal. The power consumption of the VCSEL driver was 3.0mW/Gbps/ch at 25Gbps. An optical transmitter including the VCSEL driver achieved 25-Gbps, 4-ch fully optical links.

A 50-Gb/s optical transmitter, consisting of a 25-Gb/s-class lens-integrated DFB-LD (with -3-dB bandwidth of 20GHz) and a LD-driver chip based on 0.18-µm SiGe BiCMOS technology for inter and intra-rack transmissions, was developed and tested. The DFB-LD and LD driver chip are flip-chip mounted on an alumina ceramic package. To suppress inter-symbol interference due to a shortage of the DFB-LD bandwidth and signal reflection between the DFB-LD and the package, the LD driver includes a two-tap pre-emphasis circuit and a high-speed termination circuit. Operating at a data rate of 50Gb/s, the optical transmitter enhances LD bandwidth and demonstrated an eye opening with jitter margin of 0.23UI. Power efficiency of the optical transmitter at a data rate of 50Gb/s is 16.2mW/Gb/s.

12-channel DC to 622-Mbit/s/ch optical transmitter and receiver have been developed for high-capacity and rather long (about 100 m) bit-parallel raw data transmission in intra- and inter-cabinet interconnection of large-scale switching, routing and computing system. Bit-parallel raw data transmission is done by using a bit-by-bit operational automatic decision threshold control receiver circuit with a DC-coupled configuration, the pin-PDs with their anodes and cathodes separated in a channel-by-channel manner, and a receiver preamplifier with a low-pass filter. The transmitter consists of a 12-channel LD sub-assembly unit and a LD driver LSI. The LD sub-assembly unit consists of a 12-channel array of high temperature characteristic 1.3-µm planar buried hetero-structure (PBH) LDs and 62.5/125 graded-index multi-mode fibers (GI62.5 MMFs). The 1.3-µm PBH LDs and the GI62.5 MMFs are optically coupled by passively visual alignment technology on the Si V-groove. The receiver consists of a 12-channel pin-PD sub-assembly unit and a receiver LSI. The pin-PD sub-assembly unit consist of a 12-channel array of pin-PDs and GI62.5 MMFs. They are optically coupled by using a flip-chip bonding on the Si V-groove. The transmitter and receiver each have eleven data channels and one clock channel. The size is as small as 3.6 cc for each modules, and the power consumptions are 1.7 W (transmitter) and 1.35 W (receiver). They transmitted a bit-parallel raw data through a 100-meter ribbon of GI62.5 MMFs in an ambient temperature range of 0-70C. They provide a synchronous PECL interface parallel link for with a 3.3-V single power supply.

This paper describes a 2.5-Gb/s optical receiver and transmitter chipset consisting of a preamplifier, a main amplifier, a clock and data recovery (CDR) circuit, and a laser-diode (LD) driver. Low-voltage and adjustment-free circuit techniques are introduced in order to achieve low cost and low power circuits. Circuit adjustments are eliminated by using a multi-stage automatic offset canceling technique in the main amplifier, and by using a PLL structure with a sample-and-hold technique in the CDR circuit. For power reduction, ICs are operated at a power supply voltage of -3 V. Fabricating the ICs by a 0.5-µm Si bipolar process makes it possible to achieve 2.5-Gb/s receiver and transmitter operation with a total power dissipation of 1.04 W. Especially significant is that the receiver ICs need no external devices and adjustments.