A new mixed-voltage I/O buffer for low-voltage low-latency operation is proposed in this paper. The proposed buffer adopts a novel delay-based timing-control scheme to efficiently avoid problems like gate-oxide stress and hot-carrier degradation. The proposed timing-control scheme also allows the buffer to have a lower latency for transmitting data by avoiding the use of timing-critical circuits like series-connected transmission gates (TGs) and triple-stacked transistors. The latency for receiving data at low supply voltage is also reduced by employing a variable stacked transistor gate-biasing scheme. Comparison results in an 80-nm CMOS process indicated that the proposed mixed-voltage I/O buffer improved up to 79.3% for receiving the external data and up to 23.8% for transmitting the internal data at a supply voltage of 1.2 V.

The MOS switch with bootstrapped technique is widely used in low-voltage switched-capacitor circuit. The switched-capacitor circuit with the bootstrapped technique could be a dangerous design approach in the nano-scale CMOS process due to the gate-oxide transient overstress. The impact of gate-oxide transient overstress on MOS switch in switched-capacitor circuit is investigated in this work with the sample-and-hold amplifier (SHA) in a 130-nm CMOS process. After overstress on the MOS switch of SHA with unity-gain buffer, the circuit performances in time domain and frequency domain are measured to verify the impact of gate-oxide reliability on circuit performances. The oxide breakdown on switch device degrades the circuit performance of bootstrapped switch technique.

A new method using new test structure, which is connected 15.4 million MOS transistor, for evaluating extrinsic oxide breakdown is proposed. The active gate area which is needed to predict reliability will be shown. And by using this new method, activation energy not only for the intrinsic breakdown but also for the extrinsic breakdown are obtained.