IEICE TRANSACTIONS on Communications
Small Planar Packaging System Combined with Card-On-Board Packaging for High-Speed, High-Density Switching Systems
Summary :
An innovative small planar packaging(SPP)system is described that can be combined with card-on-board(COB)packaging in high-speed asynchronous transfer mode switching systems with throughput of over 40-Gb/s. The SPP system provides high I/O pin count density and high packaging density, combining the advantages of both planar packaging used in computer systems and COB packaging used in telecommunication systems. Using a newly developed quasi-coaxial zero-insertion-force connector, point-to-point 311 Mb/s of 8-bit parallel signal transmission is achieved in an arbitrary location on the SPP system
- Publication
- IEICE TRANSACTIONS on Communications Vol.E81-B No.10 pp.1894-1902
- Publication Date
- 1998/10/25
- Publicized
- Online ISSN
- DOI
- Type of Manuscript
- Category
- Communication Systems and Transmission Equipment
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Tohru KISHIMOTO, Keiichi YASUNA, Hiroki OKA, Katsumi KAIZU, Sinichi SASAKI, Yasuo KANEKO, "Small Planar Packaging System Combined with Card-On-Board Packaging for High-Speed, High-Density Switching Systems" in IEICE TRANSACTIONS on Communications,
vol. E81-B, no. 10, pp. 1894-1902, October 1998, doi: .
Abstract: An innovative small planar packaging(SPP)system is described that can be combined with card-on-board(COB)packaging in high-speed asynchronous transfer mode switching systems with throughput of over 40-Gb/s. The SPP system provides high I/O pin count density and high packaging density, combining the advantages of both planar packaging used in computer systems and COB packaging used in telecommunication systems. Using a newly developed quasi-coaxial zero-insertion-force connector, point-to-point 311 Mb/s of 8-bit parallel signal transmission is achieved in an arbitrary location on the SPP system
URL: https://global.ieice.org/en_transactions/communications/10.1587/e81-b_10_1894/_p
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@ARTICLE{e81-b_10_1894,
author={Tohru KISHIMOTO, Keiichi YASUNA, Hiroki OKA, Katsumi KAIZU, Sinichi SASAKI, Yasuo KANEKO, },
journal={IEICE TRANSACTIONS on Communications},
title={Small Planar Packaging System Combined with Card-On-Board Packaging for High-Speed, High-Density Switching Systems},
year={1998},
volume={E81-B},
number={10},
pages={1894-1902},
abstract={An innovative small planar packaging(SPP)system is described that can be combined with card-on-board(COB)packaging in high-speed asynchronous transfer mode switching systems with throughput of over 40-Gb/s. The SPP system provides high I/O pin count density and high packaging density, combining the advantages of both planar packaging used in computer systems and COB packaging used in telecommunication systems. Using a newly developed quasi-coaxial zero-insertion-force connector, point-to-point 311 Mb/s of 8-bit parallel signal transmission is achieved in an arbitrary location on the SPP system
keywords={},
doi={},
ISSN={},
month={October},}
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TY - JOUR
TI - Small Planar Packaging System Combined with Card-On-Board Packaging for High-Speed, High-Density Switching Systems
T2 - IEICE TRANSACTIONS on Communications
SP - 1894
EP - 1902
AU - Tohru KISHIMOTO
AU - Keiichi YASUNA
AU - Hiroki OKA
AU - Katsumi KAIZU
AU - Sinichi SASAKI
AU - Yasuo KANEKO
PY - 1998
DO -
JO - IEICE TRANSACTIONS on Communications
SN -
VL - E81-B
IS - 10
JA - IEICE TRANSACTIONS on Communications
Y1 - October 1998
AB - An innovative small planar packaging(SPP)system is described that can be combined with card-on-board(COB)packaging in high-speed asynchronous transfer mode switching systems with throughput of over 40-Gb/s. The SPP system provides high I/O pin count density and high packaging density, combining the advantages of both planar packaging used in computer systems and COB packaging used in telecommunication systems. Using a newly developed quasi-coaxial zero-insertion-force connector, point-to-point 311 Mb/s of 8-bit parallel signal transmission is achieved in an arbitrary location on the SPP system
ER -
English
