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IEICE TRANSACTIONS on Communications

A 60GHz-Band High-Efficiency Antenna with a Thick Resin Layer and Differentially Fed through a Hole in a Silicon Chip

Naoya OIKAWA, Jiro HIROKAWA, Hiroshi NAKANO, Yasutake HIRACHI, Hiroshi ISONO, Atsushi ISHII, Makoto ANDO

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Summary :

For the realization of a high-efficiency antenna for 60GHz-band wireless personal area network, we propose placing a CMOS RF circuit and an antenna on opposing sides of a silicon chip. They are connected with low loss by a coaxial-line structure using a hole opening in the chip. Since the CMOS circuit is driven differentially, a differential-feed antenna is used. In this paper, we design and measure a differential-feed square patch antenna on a silicon chip. To enhance the radiation efficiency, it is placed on a 200µm thick resin layer. The calculated radiation efficiency of 79% includes the connection loss. A prototype antenna is measured in a reverberation chamber, and its radiation efficiency is estimated to be about 81±3%.

Publication
IEICE TRANSACTIONS on Communications Vol.E99-B No.1 pp.27-32
Publication Date
2016/01/01
Publicized
Online ISSN
1745-1345
DOI
10.1587/transcom.2015ISP0027
Type of Manuscript
Special Section PAPER (Special Section on Recent Progress in Antennas, Propagation and Wireless Systems Related to Topics in ISAP2014)
Category
Antennas and Propagation

Authors

Naoya OIKAWA
  Tokyo Institute of Technology
Jiro HIROKAWA
  Tokyo Institute of Technology
Hiroshi NAKANO
  Tokyo Institute of Technology
Yasutake HIRACHI
  Tokyo Institute of Technology
Hiroshi ISONO
  Shiima Electronics Inc.
Atsushi ISHII
  Shiima Electronics Inc.
Makoto ANDO
  Tokyo Institute of Technology

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