Defect Detection of Passivation Layer by a Bias-Free Cu Decoration Method
Summary :
New detection method of passivation defect was studied. The method was the Cu decoration method without bias (bias-free Cu decoration). As the result of comparison with conventional method, it was found that a bias-free Cu decoration method was effective, sensitive and simple. In this method, the difference of humidity resistance induced by poor passivation coverage could be evaluated.
- Publication
- IEICE TRANSACTIONS on Electronics Vol.E77-C No.4 pp.585-589
- Publication Date
- 1994/04/25
- Publicized
- Online ISSN
- DOI
- Type of Manuscript
- Special Section PAPER (Special Issue on LSI Failure Analysis)
- Category
Authors
Keyword
Latest Issue
Copyrights notice of machine-translated contents
The copyright of the original papers published on this site belongs to IEICE. Unauthorized use of the original or translated papers is prohibited. See IEICE Provisions on Copyright for details.
Cite this
Copy
Tetsuaki WADA, Shinji NAKANO, "Defect Detection of Passivation Layer by a Bias-Free Cu Decoration Method" in IEICE TRANSACTIONS on Electronics,
vol. E77-C, no. 4, pp. 585-589, April 1994, doi: .
Abstract: New detection method of passivation defect was studied. The method was the Cu decoration method without bias (bias-free Cu decoration). As the result of comparison with conventional method, it was found that a bias-free Cu decoration method was effective, sensitive and simple. In this method, the difference of humidity resistance induced by poor passivation coverage could be evaluated.
URL: https://global.ieice.org/en_transactions/electronics/10.1587/e77-c_4_585/_p
Copy
@ARTICLE{e77-c_4_585,
author={Tetsuaki WADA, Shinji NAKANO, },
journal={IEICE TRANSACTIONS on Electronics},
title={Defect Detection of Passivation Layer by a Bias-Free Cu Decoration Method},
year={1994},
volume={E77-C},
number={4},
pages={585-589},
abstract={New detection method of passivation defect was studied. The method was the Cu decoration method without bias (bias-free Cu decoration). As the result of comparison with conventional method, it was found that a bias-free Cu decoration method was effective, sensitive and simple. In this method, the difference of humidity resistance induced by poor passivation coverage could be evaluated.},
keywords={},
doi={},
ISSN={},
month={April},}
Copy
TY - JOUR
TI - Defect Detection of Passivation Layer by a Bias-Free Cu Decoration Method
T2 - IEICE TRANSACTIONS on Electronics
SP - 585
EP - 589
AU - Tetsuaki WADA
AU - Shinji NAKANO
PY - 1994
DO -
JO - IEICE TRANSACTIONS on Electronics
SN -
VL - E77-C
IS - 4
JA - IEICE TRANSACTIONS on Electronics
Y1 - April 1994
AB - New detection method of passivation defect was studied. The method was the Cu decoration method without bias (bias-free Cu decoration). As the result of comparison with conventional method, it was found that a bias-free Cu decoration method was effective, sensitive and simple. In this method, the difference of humidity resistance induced by poor passivation coverage could be evaluated.
ER -
English
