Examination of High-Speed, Low-Power-Consumption Thermal Head

Susumu SHIBATA

Examination of High-Speed, Low-Power-Consumption Thermal Head

Susumu SHIBATA

Full Text Views

0

Cite this

Summary :

I have examined factors for implementing a high-speed, low-power-consumption thermal head. In conventional thermal heads, a heat insulation layer is provided between the heating resistor and the radiator. I found it desirable to implement fast operation and low power consumption to lower the thermal conductivity of the heat insulation layer and to thin the heat insulation layer. I also found there is an optimum heat characteristic to the thickness of one heat insulation layer. I assumed polyimide as a material for the heat insulation layer which could materialize the hypothesis, and studied necessary items based on the thermal calculation. I manufactured a trial thermal head on the basis of this result and confirmed that our assumptions were correct. In addition, to confirm that the assumption is also ultimately correct, I fabricated a trial thermal head only consisting of a heating resistor and without a protective coat and a heat insulation layer. I confirmed that the structure with only the heating resistor exhibited excellent heat response and consumed less power necessary for heating.

Publication: IEICE TRANSACTIONS on Electronics Vol.E78-C No.11 pp.1632-1637

Publication Date: 1995/11/25

Publicized

Online ISSN

DOI

Type of Manuscript: PAPER

Category: Recording and Memory Technologies

Cite this

Copy

Susumu SHIBATA, "Examination of High-Speed, Low-Power-Consumption Thermal Head" in IEICE TRANSACTIONS on Electronics, vol. E78-C, no. 11, pp. 1632-1637, November 1995, doi: .
Abstract: I have examined factors for implementing a high-speed, low-power-consumption thermal head. In conventional thermal heads, a heat insulation layer is provided between the heating resistor and the radiator. I found it desirable to implement fast operation and low power consumption to lower the thermal conductivity of the heat insulation layer and to thin the heat insulation layer. I also found there is an optimum heat characteristic to the thickness of one heat insulation layer. I assumed polyimide as a material for the heat insulation layer which could materialize the hypothesis, and studied necessary items based on the thermal calculation. I manufactured a trial thermal head on the basis of this result and confirmed that our assumptions were correct. In addition, to confirm that the assumption is also ultimately correct, I fabricated a trial thermal head only consisting of a heating resistor and without a protective coat and a heat insulation layer. I confirmed that the structure with only the heating resistor exhibited excellent heat response and consumed less power necessary for heating.
URL: https://global.ieice.org/en_transactions/electronics/10.1587/e78-c_11_1632/_p

Copy

@ARTICLE{e78-c_11_1632,
author={Susumu SHIBATA, },
journal={IEICE TRANSACTIONS on Electronics},
title={Examination of High-Speed, Low-Power-Consumption Thermal Head},
year={1995},
volume={E78-C},
number={11},
pages={1632-1637},
abstract={I have examined factors for implementing a high-speed, low-power-consumption thermal head. In conventional thermal heads, a heat insulation layer is provided between the heating resistor and the radiator. I found it desirable to implement fast operation and low power consumption to lower the thermal conductivity of the heat insulation layer and to thin the heat insulation layer. I also found there is an optimum heat characteristic to the thickness of one heat insulation layer. I assumed polyimide as a material for the heat insulation layer which could materialize the hypothesis, and studied necessary items based on the thermal calculation. I manufactured a trial thermal head on the basis of this result and confirmed that our assumptions were correct. In addition, to confirm that the assumption is also ultimately correct, I fabricated a trial thermal head only consisting of a heating resistor and without a protective coat and a heat insulation layer. I confirmed that the structure with only the heating resistor exhibited excellent heat response and consumed less power necessary for heating.},
keywords={},
doi={},
ISSN={},
month={November},}

Copy

TY - JOUR
TI - Examination of High-Speed, Low-Power-Consumption Thermal Head
T2 - IEICE TRANSACTIONS on Electronics
SP - 1632
EP - 1637
AU - Susumu SHIBATA
PY - 1995
DO -
JO - IEICE TRANSACTIONS on Electronics
SN -
VL - E78-C
IS - 11
JA - IEICE TRANSACTIONS on Electronics
Y1 - November 1995
AB - I have examined factors for implementing a high-speed, low-power-consumption thermal head. In conventional thermal heads, a heat insulation layer is provided between the heating resistor and the radiator. I found it desirable to implement fast operation and low power consumption to lower the thermal conductivity of the heat insulation layer and to thin the heat insulation layer. I also found there is an optimum heat characteristic to the thickness of one heat insulation layer. I assumed polyimide as a material for the heat insulation layer which could materialize the hypothesis, and studied necessary items based on the thermal calculation. I manufactured a trial thermal head on the basis of this result and confirmed that our assumptions were correct. In addition, to confirm that the assumption is also ultimately correct, I fabricated a trial thermal head only consisting of a heating resistor and without a protective coat and a heat insulation layer. I confirmed that the structure with only the heating resistor exhibited excellent heat response and consumed less power necessary for heating.
ER -