Heat-Pipe Cooling Technology for High-Speed ATM Switching Multichip Modules

Tohru KISHIMOTO; Shinichi SASAKI; Katsumi KAIZU; Kouichi GENDA; Kenichi ENDO

Heat-Pipe Cooling Technology for High-Speed ATM Switching Multichip Modules

Tohru KISHIMOTO, Shinichi SASAKI, Katsumi KAIZU, Kouichi GENDA, Kenichi ENDO

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This paper describes an innovative heat-pipe cooling technology for asynchronous transfer mode (ATM) switching multichip modules (MCMs) operating with a throughput of 40 Gb/s. Although high-speed ATM link-wires are connected at the top surface of the MCMs, there is no room to cool the MCM by forced air convection, because power and the system clock signal are supplied by connectors on the rear and periphery of the MCM. We therefore chose to attach a cold-plate to the back of each MCM. The condenser part of the heat pipe, which is mounted behind the power supply printed circuit board, is cooled by low-velocity forced air. Total power dissipation is about 30 watts per MCM. With a 2 m/s foreced airflow, the sub-switching-element module (four MCMs) operates at a throughput of 80 Gb/s with a maximum junction temperature of less than 85. Measured thermal resistance between the switch LSI junction and air is about 6/W. This heat-pipe cooling system has a small system footprint, compact hardware, and good cooling capacity.

Publication: IEICE TRANSACTIONS on Electronics Vol.E78-C No.5 pp.564-573

Publication Date: 1995/05/25

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Type of Manuscript: PAPER

Category: Instrumentation and Control

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Tohru KISHIMOTO, Shinichi SASAKI, Katsumi KAIZU, Kouichi GENDA, Kenichi ENDO, "Heat-Pipe Cooling Technology for High-Speed ATM Switching Multichip Modules" in IEICE TRANSACTIONS on Electronics, vol. E78-C, no. 5, pp. 564-573, May 1995, doi: .
Abstract: This paper describes an innovative heat-pipe cooling technology for asynchronous transfer mode (ATM) switching multichip modules (MCMs) operating with a throughput of 40 Gb/s. Although high-speed ATM link-wires are connected at the top surface of the MCMs, there is no room to cool the MCM by forced air convection, because power and the system clock signal are supplied by connectors on the rear and periphery of the MCM. We therefore chose to attach a cold-plate to the back of each MCM. The condenser part of the heat pipe, which is mounted behind the power supply printed circuit board, is cooled by low-velocity forced air. Total power dissipation is about 30 watts per MCM. With a 2 m/s foreced airflow, the sub-switching-element module (four MCMs) operates at a throughput of 80 Gb/s with a maximum junction temperature of less than 85. Measured thermal resistance between the switch LSI junction and air is about 6/W. This heat-pipe cooling system has a small system footprint, compact hardware, and good cooling capacity.
URL: https://global.ieice.org/en_transactions/electronics/10.1587/e78-c_5_564/_p

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@ARTICLE{e78-c_5_564,
author={Tohru KISHIMOTO, Shinichi SASAKI, Katsumi KAIZU, Kouichi GENDA, Kenichi ENDO, },
journal={IEICE TRANSACTIONS on Electronics},
title={Heat-Pipe Cooling Technology for High-Speed ATM Switching Multichip Modules},
year={1995},
volume={E78-C},
number={5},
pages={564-573},
abstract={This paper describes an innovative heat-pipe cooling technology for asynchronous transfer mode (ATM) switching multichip modules (MCMs) operating with a throughput of 40 Gb/s. Although high-speed ATM link-wires are connected at the top surface of the MCMs, there is no room to cool the MCM by forced air convection, because power and the system clock signal are supplied by connectors on the rear and periphery of the MCM. We therefore chose to attach a cold-plate to the back of each MCM. The condenser part of the heat pipe, which is mounted behind the power supply printed circuit board, is cooled by low-velocity forced air. Total power dissipation is about 30 watts per MCM. With a 2 m/s foreced airflow, the sub-switching-element module (four MCMs) operates at a throughput of 80 Gb/s with a maximum junction temperature of less than 85. Measured thermal resistance between the switch LSI junction and air is about 6/W. This heat-pipe cooling system has a small system footprint, compact hardware, and good cooling capacity.},
keywords={},
doi={},
ISSN={},
month={May},}

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TY - JOUR
TI - Heat-Pipe Cooling Technology for High-Speed ATM Switching Multichip Modules
T2 - IEICE TRANSACTIONS on Electronics
SP - 564
EP - 573
AU - Tohru KISHIMOTO
AU - Shinichi SASAKI
AU - Katsumi KAIZU
AU - Kouichi GENDA
AU - Kenichi ENDO
PY - 1995
DO -
JO - IEICE TRANSACTIONS on Electronics
SN -
VL - E78-C
IS - 5
JA - IEICE TRANSACTIONS on Electronics
Y1 - May 1995
AB - This paper describes an innovative heat-pipe cooling technology for asynchronous transfer mode (ATM) switching multichip modules (MCMs) operating with a throughput of 40 Gb/s. Although high-speed ATM link-wires are connected at the top surface of the MCMs, there is no room to cool the MCM by forced air convection, because power and the system clock signal are supplied by connectors on the rear and periphery of the MCM. We therefore chose to attach a cold-plate to the back of each MCM. The condenser part of the heat pipe, which is mounted behind the power supply printed circuit board, is cooled by low-velocity forced air. Total power dissipation is about 30 watts per MCM. With a 2 m/s foreced airflow, the sub-switching-element module (four MCMs) operates at a throughput of 80 Gb/s with a maximum junction temperature of less than 85. Measured thermal resistance between the switch LSI junction and air is about 6/W. This heat-pipe cooling system has a small system footprint, compact hardware, and good cooling capacity.
ER -