Fabrication Processes for High-Tc Superconducting Integrated Circuits Based on Edge-Type Josephson Junctions
Summary :
We have studied an in situ edge preparation process and the effect of a substrate rotation during the edge preparation in order to improve the uniformity and electrical characteristics of high-Tc edge-type Josephson junctions. The improved YBa2Cu3Ox/PrBa2Cu3Ox/YBa2Cu3Ox edge junctions showed small 1σ-critical current spreads as low as 10% for 12 junctions. We have confirmed that the spreads do not increase significantly by adding groundplane over the junctions. In this paper, we will describe these processes developed for the fabrication of high-Tc superconducting integrated circuits.
- Publication
- IEICE TRANSACTIONS on Electronics Vol.E81-C No.10 pp.1532-1537
- Publication Date
- 1998/10/25
- Publicized
- Online ISSN
- DOI
- Type of Manuscript
- Special Section INVITED PAPER (Special Issue on Low- and High-Temperature Superconductive Electron Devices and Their Applications)
- Category
- High-Tc Junction Technology
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Tetsuro SATOH, Mutsuo HIDAKA, Shuichi TAHARA, "Fabrication Processes for High-Tc Superconducting Integrated Circuits Based on Edge-Type Josephson Junctions" in IEICE TRANSACTIONS on Electronics,
vol. E81-C, no. 10, pp. 1532-1537, October 1998, doi: .
Abstract: We have studied an in situ edge preparation process and the effect of a substrate rotation during the edge preparation in order to improve the uniformity and electrical characteristics of high-Tc edge-type Josephson junctions. The improved YBa2Cu3Ox/PrBa2Cu3Ox/YBa2Cu3Ox edge junctions showed small 1σ-critical current spreads as low as 10% for 12 junctions. We have confirmed that the spreads do not increase significantly by adding groundplane over the junctions. In this paper, we will describe these processes developed for the fabrication of high-Tc superconducting integrated circuits.
URL: https://global.ieice.org/en_transactions/electronics/10.1587/e81-c_10_1532/_p
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@ARTICLE{e81-c_10_1532,
author={Tetsuro SATOH, Mutsuo HIDAKA, Shuichi TAHARA, },
journal={IEICE TRANSACTIONS on Electronics},
title={Fabrication Processes for High-Tc Superconducting Integrated Circuits Based on Edge-Type Josephson Junctions},
year={1998},
volume={E81-C},
number={10},
pages={1532-1537},
abstract={We have studied an in situ edge preparation process and the effect of a substrate rotation during the edge preparation in order to improve the uniformity and electrical characteristics of high-Tc edge-type Josephson junctions. The improved YBa2Cu3Ox/PrBa2Cu3Ox/YBa2Cu3Ox edge junctions showed small 1σ-critical current spreads as low as 10% for 12 junctions. We have confirmed that the spreads do not increase significantly by adding groundplane over the junctions. In this paper, we will describe these processes developed for the fabrication of high-Tc superconducting integrated circuits.},
keywords={},
doi={},
ISSN={},
month={October},}
Copy
TY - JOUR
TI - Fabrication Processes for High-Tc Superconducting Integrated Circuits Based on Edge-Type Josephson Junctions
T2 - IEICE TRANSACTIONS on Electronics
SP - 1532
EP - 1537
AU - Tetsuro SATOH
AU - Mutsuo HIDAKA
AU - Shuichi TAHARA
PY - 1998
DO -
JO - IEICE TRANSACTIONS on Electronics
SN -
VL - E81-C
IS - 10
JA - IEICE TRANSACTIONS on Electronics
Y1 - October 1998
AB - We have studied an in situ edge preparation process and the effect of a substrate rotation during the edge preparation in order to improve the uniformity and electrical characteristics of high-Tc edge-type Josephson junctions. The improved YBa2Cu3Ox/PrBa2Cu3Ox/YBa2Cu3Ox edge junctions showed small 1σ-critical current spreads as low as 10% for 12 junctions. We have confirmed that the spreads do not increase significantly by adding groundplane over the junctions. In this paper, we will describe these processes developed for the fabrication of high-Tc superconducting integrated circuits.
ER -
English
