Hybrid Integrated 4<cd0215f.gif>4 Optical Matrix Switch Module on Silica Based Planar Waveguide Platform

Tomoaki KATO; Jun-ichi SASAKI; Tsuyoshi SHIMODA; Hiroshi HATAKEYAMA; Takemasa TAMANUKI; Shotaro KITAMURA; Masayuki YAMAGUCHI; Tatsuya SASAKI; Keiro KOMATSU; Mitsuhiro KITAMURA; Masataka ITOH

Hybrid Integrated 44 Optical Matrix Switch Module on Silica Based Planar Waveguide Platform

Tomoaki KATO, Jun-ichi SASAKI, Tsuyoshi SHIMODA, Hiroshi HATAKEYAMA, Takemasa TAMANUKI, Shotaro KITAMURA, Masayuki YAMAGUCHI, Tatsuya SASAKI, Keiro KOMATSU, Mitsuhiro KITAMURA, Masataka ITOH

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The hybrid electrical/optical multi-chip integration technique for optical modules for optical network system has been developed. Employing the technique, a 44 broadcast-and-select type optical matrix switch module has been realized. The module consists of four sets of silica waveguide 1 : 4 splitters/4 : 1 combiners, four 4-channel arrays of polarization insensitive semiconductor optical amplifiers with spot-size converters as optical gates, printed wiring chips for electrical wiring and single mode fibers for optical signal interface on planar waveguide platform fabricated by atmospheric pressure chemical vapor deposition. All the gates and the wiring chips were mounted precisely onto the platform at once in flip-chip manner by self-align technique using AuSn solder bumps. Coupling loss between the waveguide and the SOA gate was estimated to be 4.5 dB. Averaged fiber-to-fiber signal gain, on-off ratio and polarization dependent loss for each of the signal paths was 7 dB 2 dB, more than 40 dB and 0.5 dB, respectively. High speed 10 Gb/s photonic cell switching as short as 2 nsec has been successfully achieved.

Publication: IEICE TRANSACTIONS on Electronics Vol.E82-C No.2 pp.305-312

Publication Date: 1999/02/25

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Type of Manuscript: Special Section INVITED PAPER (Joint Special Issue on Photonics in Switching: Systems and Devices)

Category: Photonic Switching Devices

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Tomoaki KATO, Jun-ichi SASAKI, Tsuyoshi SHIMODA, Hiroshi HATAKEYAMA, Takemasa TAMANUKI, Shotaro KITAMURA, Masayuki YAMAGUCHI, Tatsuya SASAKI, Keiro KOMATSU, Mitsuhiro KITAMURA, Masataka ITOH, "Hybrid Integrated 44 Optical Matrix Switch Module on Silica Based Planar Waveguide Platform" in IEICE TRANSACTIONS on Electronics, vol. E82-C, no. 2, pp. 305-312, February 1999, doi: .
Abstract: The hybrid electrical/optical multi-chip integration technique for optical modules for optical network system has been developed. Employing the technique, a 44 broadcast-and-select type optical matrix switch module has been realized. The module consists of four sets of silica waveguide 1 : 4 splitters/4 : 1 combiners, four 4-channel arrays of polarization insensitive semiconductor optical amplifiers with spot-size converters as optical gates, printed wiring chips for electrical wiring and single mode fibers for optical signal interface on planar waveguide platform fabricated by atmospheric pressure chemical vapor deposition. All the gates and the wiring chips were mounted precisely onto the platform at once in flip-chip manner by self-align technique using AuSn solder bumps. Coupling loss between the waveguide and the SOA gate was estimated to be 4.5 dB. Averaged fiber-to-fiber signal gain, on-off ratio and polarization dependent loss for each of the signal paths was 7 dB 2 dB, more than 40 dB and 0.5 dB, respectively. High speed 10 Gb/s photonic cell switching as short as 2 nsec has been successfully achieved.
URL: https://global.ieice.org/en_transactions/electronics/10.1587/e82-c_2_305/_p

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@ARTICLE{e82-c_2_305,
author={Tomoaki KATO, Jun-ichi SASAKI, Tsuyoshi SHIMODA, Hiroshi HATAKEYAMA, Takemasa TAMANUKI, Shotaro KITAMURA, Masayuki YAMAGUCHI, Tatsuya SASAKI, Keiro KOMATSU, Mitsuhiro KITAMURA, Masataka ITOH, },
journal={IEICE TRANSACTIONS on Electronics},
title={Hybrid Integrated 44 Optical Matrix Switch Module on Silica Based Planar Waveguide Platform},
year={1999},
volume={E82-C},
number={2},
pages={305-312},
abstract={The hybrid electrical/optical multi-chip integration technique for optical modules for optical network system has been developed. Employing the technique, a 44 broadcast-and-select type optical matrix switch module has been realized. The module consists of four sets of silica waveguide 1 : 4 splitters/4 : 1 combiners, four 4-channel arrays of polarization insensitive semiconductor optical amplifiers with spot-size converters as optical gates, printed wiring chips for electrical wiring and single mode fibers for optical signal interface on planar waveguide platform fabricated by atmospheric pressure chemical vapor deposition. All the gates and the wiring chips were mounted precisely onto the platform at once in flip-chip manner by self-align technique using AuSn solder bumps. Coupling loss between the waveguide and the SOA gate was estimated to be 4.5 dB. Averaged fiber-to-fiber signal gain, on-off ratio and polarization dependent loss for each of the signal paths was 7 dB 2 dB, more than 40 dB and 0.5 dB, respectively. High speed 10 Gb/s photonic cell switching as short as 2 nsec has been successfully achieved.},
keywords={},
doi={},
ISSN={},
month={February},}

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TY - JOUR
TI - Hybrid Integrated 44 Optical Matrix Switch Module on Silica Based Planar Waveguide Platform
T2 - IEICE TRANSACTIONS on Electronics
SP - 305
EP - 312
AU - Tomoaki KATO
AU - Jun-ichi SASAKI
AU - Tsuyoshi SHIMODA
AU - Hiroshi HATAKEYAMA
AU - Takemasa TAMANUKI
AU - Shotaro KITAMURA
AU - Masayuki YAMAGUCHI
AU - Tatsuya SASAKI
AU - Keiro KOMATSU
AU - Mitsuhiro KITAMURA
AU - Masataka ITOH
PY - 1999
DO -
JO - IEICE TRANSACTIONS on Electronics
SN -
VL - E82-C
IS - 2
JA - IEICE TRANSACTIONS on Electronics
Y1 - February 1999
AB - The hybrid electrical/optical multi-chip integration technique for optical modules for optical network system has been developed. Employing the technique, a 44 broadcast-and-select type optical matrix switch module has been realized. The module consists of four sets of silica waveguide 1 : 4 splitters/4 : 1 combiners, four 4-channel arrays of polarization insensitive semiconductor optical amplifiers with spot-size converters as optical gates, printed wiring chips for electrical wiring and single mode fibers for optical signal interface on planar waveguide platform fabricated by atmospheric pressure chemical vapor deposition. All the gates and the wiring chips were mounted precisely onto the platform at once in flip-chip manner by self-align technique using AuSn solder bumps. Coupling loss between the waveguide and the SOA gate was estimated to be 4.5 dB. Averaged fiber-to-fiber signal gain, on-off ratio and polarization dependent loss for each of the signal paths was 7 dB 2 dB, more than 40 dB and 0.5 dB, respectively. High speed 10 Gb/s photonic cell switching as short as 2 nsec has been successfully achieved.
ER -