A New Three-Piece Driver Model with RLC Interconnect Load
Summary :
The scaled down feature size and the increased frequency of today's deep sub-micron region call for fundamental changes in driver-load models. To be more specific, new driver-load models need to take into consideration the nonlinear behavior of the drivers, the inductance effects of the loads, and the slew rates of the output waveforms. Current driver-load models use the conventional single Ceff (one-ramp) approach and treat the interconnect load as lumped RC networks. Neither the nonlinear property nor the inductance effects were considered. The accuracy of these existing models is therefore questionable. This paper introduces a new multi-ramp driver model that represents the interconnect load as a distributed RLC network. The employed two effective capacitance values capture the nonlinear behavior of the driver. The lossy transmission line approach accounts for the impact of inductance when modeling the driving point interconnect load. The new model shows improvements of 9% in the average delay error and 2.2% in the slew rate error compared to SPICE.
- Publication
- IEICE TRANSACTIONS on Fundamentals Vol.E88-A No.8 pp.2206-2215
- Publication Date
- 2005/08/01
- Publicized
- Online ISSN
- DOI
- 10.1093/ietfec/e88-a.8.2206
- Type of Manuscript
- PAPER
- Category
- VLSI Design Technology and CAD
Authors
Keyword
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Lakshmi K. VAKATI, Kishore K. MUCHHERLA, Janet M. WANG, "A New Three-Piece Driver Model with RLC Interconnect Load" in IEICE TRANSACTIONS on Fundamentals,
vol. E88-A, no. 8, pp. 2206-2215, August 2005, doi: 10.1093/ietfec/e88-a.8.2206.
Abstract: The scaled down feature size and the increased frequency of today's deep sub-micron region call for fundamental changes in driver-load models. To be more specific, new driver-load models need to take into consideration the nonlinear behavior of the drivers, the inductance effects of the loads, and the slew rates of the output waveforms. Current driver-load models use the conventional single Ceff (one-ramp) approach and treat the interconnect load as lumped RC networks. Neither the nonlinear property nor the inductance effects were considered. The accuracy of these existing models is therefore questionable. This paper introduces a new multi-ramp driver model that represents the interconnect load as a distributed RLC network. The employed two effective capacitance values capture the nonlinear behavior of the driver. The lossy transmission line approach accounts for the impact of inductance when modeling the driving point interconnect load. The new model shows improvements of 9% in the average delay error and 2.2% in the slew rate error compared to SPICE.
URL: https://global.ieice.org/en_transactions/fundamentals/10.1093/ietfec/e88-a.8.2206/_p
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@ARTICLE{e88-a_8_2206,
author={Lakshmi K. VAKATI, Kishore K. MUCHHERLA, Janet M. WANG, },
journal={IEICE TRANSACTIONS on Fundamentals},
title={A New Three-Piece Driver Model with RLC Interconnect Load},
year={2005},
volume={E88-A},
number={8},
pages={2206-2215},
abstract={The scaled down feature size and the increased frequency of today's deep sub-micron region call for fundamental changes in driver-load models. To be more specific, new driver-load models need to take into consideration the nonlinear behavior of the drivers, the inductance effects of the loads, and the slew rates of the output waveforms. Current driver-load models use the conventional single Ceff (one-ramp) approach and treat the interconnect load as lumped RC networks. Neither the nonlinear property nor the inductance effects were considered. The accuracy of these existing models is therefore questionable. This paper introduces a new multi-ramp driver model that represents the interconnect load as a distributed RLC network. The employed two effective capacitance values capture the nonlinear behavior of the driver. The lossy transmission line approach accounts for the impact of inductance when modeling the driving point interconnect load. The new model shows improvements of 9% in the average delay error and 2.2% in the slew rate error compared to SPICE.},
keywords={},
doi={10.1093/ietfec/e88-a.8.2206},
ISSN={},
month={August},}
Copy
TY - JOUR
TI - A New Three-Piece Driver Model with RLC Interconnect Load
T2 - IEICE TRANSACTIONS on Fundamentals
SP - 2206
EP - 2215
AU - Lakshmi K. VAKATI
AU - Kishore K. MUCHHERLA
AU - Janet M. WANG
PY - 2005
DO - 10.1093/ietfec/e88-a.8.2206
JO - IEICE TRANSACTIONS on Fundamentals
SN -
VL - E88-A
IS - 8
JA - IEICE TRANSACTIONS on Fundamentals
Y1 - August 2005
AB - The scaled down feature size and the increased frequency of today's deep sub-micron region call for fundamental changes in driver-load models. To be more specific, new driver-load models need to take into consideration the nonlinear behavior of the drivers, the inductance effects of the loads, and the slew rates of the output waveforms. Current driver-load models use the conventional single Ceff (one-ramp) approach and treat the interconnect load as lumped RC networks. Neither the nonlinear property nor the inductance effects were considered. The accuracy of these existing models is therefore questionable. This paper introduces a new multi-ramp driver model that represents the interconnect load as a distributed RLC network. The employed two effective capacitance values capture the nonlinear behavior of the driver. The lossy transmission line approach accounts for the impact of inductance when modeling the driving point interconnect load. The new model shows improvements of 9% in the average delay error and 2.2% in the slew rate error compared to SPICE.
ER -
English
