A 167-MHz 1-Mbit CMOS synchronous cache SRAM was developed using 0.40-µm process technology. The floor plan was designed so that the address registers are located in the center of the chip, and high-speed circuits were developed such as the quasi latch (QL) sense amplifier and the one-shot control (OSC) output register. To maintain suitable setup and hold time margins, an equivalent margin (EM) design method was developed. 167-MHz operation was measured at a supply voltage of 2.5 V and an ambient temperature of 75. The same margins 1.1 ns of the setup time and hold time were measured for the specifications of a setup time of 2.0 ns and a hold time of 0.5 ns.

We have applied hot-carrier circuit-level simulation to memory peripheral circuits of a few thousand to over 12K transistors using a simple but accurate degradation model for reliability verification of actual memory products. By applying simulation to entire circuits, it was found that the location of maximum degradation depended greatly upon circuit configuration and device technology. A design curve has been developed to quickly relate device-level DC lifetime to circuit-level performance lifetime. Using these results in conjunction with a methodology that has been developed to predict hot-carrier degradation early in the design cycle before TEG fabrication, accurate total-circuit simulation is applied early in the design process, making reliability simulation a crucial design tool rather than a verification tool as technology advances into the deep sub-micron high clock rate regime.