This paper presents an efficient application of hot-carrier reliability simulation to delay libraries of 0.18µm and 0.14µm gate length logic products. Using analysis of simple primitive inverter cells, a design rule was developed in restricting signal rise time, and delay libraries of actual products were screened to check whether the rise time restrictions were met. At 200MHz, maximum rise time (0-100%) triseMAX was 0.8nsec (17% of duty) under Δtd/td = 5%. For a 800,000 net product, only 25 simulations were done (each less than one minute CPU time) for the internal devices with screening done for this logic process. 30 nets were caught, but judged reliable due to their reduced duty.

New insights pertaining to hot-carrier degradation of CMOS inverters have been obtained using an in-house reliability simulator named HIRES (Hitachi Reliability Simulator). The simulation of three out of four different inverter configurations which utilize series-connected NMOSFET devices between the output node and ground results in higher levels if degradation than that induced by intuition. For two of the configurations--the cascode inverter (where the gate of all NMOSFET's are connected to the input) and the two-input NAND gate--degradation levels are comparable to that of a simple two-transistor CMOS inverter. This high level of degradation is found to be caused by the fact that most of the output voltage is dropped across one of the series-connected NMOSFET transistors rather than being equally divided between the two. From degradation simulation results, a design methodology is developed to optimize the inverter circuits to minimize hot-carrier degradation by balancing the degradation suffered between the two series-connected NMOSFET's. Using this approach, up to a factor of 109 improvement in device lifetime is achieved.

We have applied hot-carrier circuit-level simulation to memory peripheral circuits of a few thousand to over 12K transistors using a simple but accurate degradation model for reliability verification of actual memory products. By applying simulation to entire circuits, it was found that the location of maximum degradation depended greatly upon circuit configuration and device technology. A design curve has been developed to quickly relate device-level DC lifetime to circuit-level performance lifetime. Using these results in conjunction with a methodology that has been developed to predict hot-carrier degradation early in the design cycle before TEG fabrication, accurate total-circuit simulation is applied early in the design process, making reliability simulation a crucial design tool rather than a verification tool as technology advances into the deep sub-micron high clock rate regime.