Vertical Power MOSFETs are widely designed by deep well structures for breakdown requirement. In this study, we proposed, simulated, and analyzed a "shallow dual well" structure Power MOSFET, which utilize an n-well to cover the conventional p-well. The cell pitch can be reduced and results in an increased cell density. The reduced cell pitch and increased cell density improves the gate charge and on resistance performances about 66.5% and 15.8% without sacrificing the device breakdown owing to a shallow junction design. In addition, with the dual well structure design, the breakdown point will occur at the center of the well. Therefore, the capability of avalanche energy can be improved about 1.9 times than the tradition well structure.

A new cell structure Power MOSFET, which exhibits a lower on-state resistance and lower gate charge than the conventional layout geometry, is proposed in this research. Vertical Power MOSFETs are generally designed by either squared (closed) cell or stripe (linear) cell geometry; each has its own advantages and drawbacks. Typically, closed cell design has lower on resistance but higher gate charge characteristics than the linear one. In this study, we propose, fabricate, and analyze a "wing cell" structure Power MOSFET, which can have lower on resistance and lower gate charge performances than the closed cell structure. In addition, the wing cell design can avoid the "closed concept" patents.