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[Author] Michio YOKOYAMA(5hit)

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  • A 70 MHz Multiplierless FIR Hilbert Transformer in 0.35 µm Standard CMOS Library

    Yasuhiro TAKAHASHI  Toshikazu SEKINE  Michio YOKOYAMA  

     
    PAPER-VLSI Design Technology and CAD

      Vol:
    E90-A No:7
      Page(s):
    1376-1383

    This paper presents the implementation of a 31-tap FIR Hilbert transform digital filter chip used in the digital-IF receivers, to confirm the effectiveness of our new design method. Our design method that we previously reported is based on a computation sharing multiplier using a new horizontal and vertical common subexpression techniques. A 31-tap FIR Hilbert transform digital filter was implemented and fabricated in 0.35 µm CMOS standard cell library. The chip's core contains approximately 33k transistors and occupies 0.86 mm2. The chip also has an operating speed of 70 MHz over. The implementation results show that the proposed Hilbert transformer has a smallest cost factor and so that is a high performance filter.

  • VLSI Implementation of a 44-bit Multiplier in a Two Phase Drive Adiabatic Dynamic CMOS Logic

    Yasuhiro TAKAHASHI  Toshikazu SEKINE  Michio YOKOYAMA  

     
    LETTER

      Vol:
    E90-C No:10
      Page(s):
    2002-2006

    An adiabatic logic is a technique to design low power digital VLSI's. This paper describes the design and VLSI implementation of a multiplier using a two phase drive adiabatic dynamic CMOS logic (2PADCL) circuit. Circuit operation and performance have been evaluated using a 44-bit 2PADCL multiplier fabricated in a 1.2 µm CMOS process. The experimental results show that the multiplier was operated with clock frequencies 800 kHz. The total power dissipation of the 44-bit 2PADCL multiplier was also 5.19 mW at the 1.5 V DC power supply voltage.

  • A New Concept of 3-Dimentional Multilayer-Stacked System-in-Package for Software-Defined-Radio

    Kazuo TSUBOUCHI  Michio YOKOYAMA  Hiroyuki NAKASE  

     
    PAPER

      Vol:
    E84-C No:12
      Page(s):
    1730-1734

    In the present GHz-clock high-density LSI, a design of signal lines is getting so critical that the transmission line analysis should be introduced to signal line design. This leads to the complex design of line structure and i/o drivers including impedance matching. Our target is to implement a system-in-package (SiP) for software-defined-radio (SDR). The SiP operates up to 10 GHz, and requires a compact and high-density packaging technology with a simple signal wiring design. In this paper, we propose a new concept of 3-D multilayer-stacked SiP. The new 3-D packaging concept includes (1) design guideline for interconnection lengths, (2) bridging register circuits in LSI chips, (3) flip-chip microbump bonding technology of chips onto system-buildup printed wiring boards (PWB), (4) multilayer-stacked 3-D package of several sets of chips and PWB, and (5) 100-µm-diameter bumps at peripheral region of PWB as vertical via-bump bus lines. A critical interconnect length, in which interconnect wiring is treated as a conventional RC line, is discussed for wiring design. Both wiring lengths in LSI chips and that among chips corresponding to total thickness of vertical bus lines are designed to be shorter than the critical length. The key points of the 3-D package for GHz signal transfer are a delay guarantee due to limitation of line length and separation between local lines in a chip and a bus line among chips.

  • Flexible and Printable Phase Shifter with Polymer Actuator for 12-GHz Band

    Fumio SATO  Michio YOKOYAMA  Yudai USAMI  Kentaro YAZAWA  Takao KUKI  Shizuo TOKITO  

     
    PAPER

      Vol:
    E101-C No:10
      Page(s):
    767-774

    The authors have proposed a new type of flexible and printable 12GHz-band phase shifter using polymer actuator for the first time. Polymer bending actuator was used as a termination device of a reflection-type 3-dB, 90° hybrid coupler as the phase-shift control unit which controls the electrical length of the waveguide for microwave signals by the applied bias voltage. The microstrip line circuit of the device has been fabricated using low-cost screen printing method. Polymer bending actuator having three-layer stacking structure, in which an ionic liquid electrolyte layer is sandwiched with two conductive network composite layers, was formed by wet processes. The authors have confirmed that the phase shift could be controlled in analog by low driving voltages of 2-7 V for the actuator with a insertion loss of 2.73 dB. This phase shifter can be integrated with flexible patch antenna and the current flexible polymer electronics devices such as transistors.

  • Carry Propagation Free Adder/Subtracter Using Adiabatic Dynamic CMOS Logic Circuit Technology

    Yasuhiro TAKAHASHI  Kei-ichi KONTA  Kazukiyo TAKAHASHI  Michio YOKOYAMA  Kazuhiro SHOUNO  Mitsuru MIZUNUMA  

     
    PAPER

      Vol:
    E86-A No:6
      Page(s):
    1437-1444

    This paper describes a design of a Carry Propagation Free Adder/Subtracter (CPFA/S) VLSI using the Adiabatic Dynamic CMOS Logic (ADCL) circuit technology. Using a PSPICE simulator, energy dissipation of the ADCL 1 bit CPFA/S is compared with that of the CMOS 1 bit CPFA/S. As a result, energy dissipation of the proposed ADCL circuits is about 1/3 as high as that of the CMOS circuits. The transistors count, propagation-delay time and energy dissipation of the ADCL 4 bit CPFA/S are compared with those of the ADCL 4 bit Ripple Carry Adder/Subtracter (RCA/S). The transistors count and propagation-delay time are found to be reduced by 7.02% and 57.1%, respectively. Also, energy dissipation is found to be reduced by 78.4%. Circuit operation and performance are evaluated using a chain of the ADCL 1 bit CPFA/S fabricated in a 1.2 µm CMOS process. The experimental results show that addition and subtraction are operated with clock frequencies up to about 1 MHz. In addition, the total power dissipation of the ADCL 1 bit CPFA/S is 28.7 µW including the power supply.