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Wataru KOBAYASHI Naoki FUJIWARA Takahiko SHINDO Yoshitaka OHISO Shigeru KANAZAWA Hiroyuki ISHII Koichi HASEBE Hideaki MATSUZAKI Mikitaka ITOH
We propose a novel structure that can reduce the power consumption and extend the transmission distance of an electro-absorption modulator integrated with a DFB (EADFB) laser. To overcome the trade-off relationship of the optical loss and chirp parameter of the EA modulator, we integrate a semiconductor optical amplifier (SOA) with an EADFB laser. With the proposed SOA assisted extended reach EADFB laser (AXEL) structure, the LD and SOA sections are operated by an electrically connected input port. We describe a design for AXEL that optimizes the LD and SOA length ratio when their total operation current is 80mA. By using the designed AXEL, the power consumption of a 10-Gbit/s, 1.55-µm EADFB laser is reduced by 1/2 and at the same time the transmission distance is extended from 80 to 100km.
Takashi YAMADA Toshikazu HASHIMOTO Takaharu OHYAMA Yuji AKAHORI Akimasa KANEKO Kazutoshi KATO Ryouichi KASAHARA Mikitaka ITO
We have developed a new planar lightwave circuit (PLC) platform eliminating Si terraces for hybrid integrated optical modules. This PLC platform has the advantage of a lower fabrication cost than the conventional PLC platform with an Si terrace, because it does not require fabrication processes such as Si terrace forming and mechanical polishing. Using our new PLC platform structure, we fabricated a transceiver for optical access networks and an 8-channel multi-channel photoreceiver for wavelength division multiplexing (WDM) interconnection systems.
Takashi YAMADA Toshikazu HASHIMOTO Takaharu OHYAMA Yuji AKAHORI Akimasa KANEKO Kazutoshi KATO Ryouichi KASAHARA Mikitaka ITO
We have developed a new planar lightwave circuit (PLC) platform eliminating Si terraces for hybrid integrated optical modules. This PLC platform has the advantage of a lower fabrication cost than the conventional PLC platform with an Si terrace, because it does not require fabrication processes such as Si terrace forming and mechanical polishing. Using our new PLC platform structure, we fabricated a transceiver for optical access networks and an 8-channel multi-channel photoreceiver for wavelength division multiplexing (WDM) interconnection systems.