We have developed a new planar lightwave circuit (PLC) platform eliminating Si terraces for hybrid integrated optical modules. This PLC platform has the advantage of a lower fabrication cost than the conventional PLC platform with an Si terrace, because it does not require fabrication processes such as Si terrace forming and mechanical polishing. Using our new PLC platform structure, we fabricated a transceiver for optical access networks and an 8-channel multi-channel photoreceiver for wavelength division multiplexing (WDM) interconnection systems.

We have developed a new planar lightwave circuit (PLC) platform eliminating Si terraces for hybrid integrated optical modules. This PLC platform has the advantage of a lower fabrication cost than the conventional PLC platform with an Si terrace, because it does not require fabrication processes such as Si terrace forming and mechanical polishing. Using our new PLC platform structure, we fabricated a transceiver for optical access networks and an 8-channel multi-channel photoreceiver for wavelength division multiplexing (WDM) interconnection systems.

We have developed an experimental 5-Tb/s packet-by-packet wavelength switching system, OPTIMA-2. This paper describes its hardware architecture. OPTIMA-2 is a non-blocking 3-stage switch using optical wavelength division multiplexing (WDM) links and dynamic bandwidth-sharing. A new scheduling algorithm for variable-length packets is used for the receiver ports of WDM links and simulation results show that it can suppress short-packet delay while keeping high throughput. An implementation of the WDM link using field programable gate arrays and a compact planar lightwave circuit platform is described. Experimental results for the basic operation of optical wavelength switching are also presented.

Optoelectronic hybrid integration is a promising technology for realizing the optical components needed in optical transmission, switching, and interconnection systems that use wavelength division multiplexing (WDM) and time division multiplexing (TDM). We have already developed versatile optical hybrid integrated modules using a silica-based planar lightwave circuit (PLC) platform. However, these modules consist solely of the optoelectronic semiconductor devices such as laser diodes (LDs) and photo diodes (PDs) and monolithic optoelectronic integrated circuits (OEICs). To carry out high-speed and versatile electric signal processing functions in future network systems, it is necessary to install semiconductor electrical integrated circuits (ICs) on a PLC platform. In this paper, we describe novel technologies for high-speed PLC platforms which make it possible to assemble both ICs and optoelectronic devices. Using these technologies, we fabricated a two-channel hybrid integrated optical transmitter module which is hybrid integrated with an LD array chip and an LD driver IC. On this PLC platform, we use microstrip lines (MSLs) to drive the LD driver IC. We also considered the effect of heat interference on the LD array chip caused by the LD driver IC when designing the layout of the chip assembly region. The LD array chip and the LD driver IC were flip-chip bonded with solder bumps of a different material to avoid any deterioration in the coupling efficiency of the LD array chip. The optical transmitter module we fabricated operated successfully at 9 Gbit/s non-return-zero (NRZ) signal. This approach using a PLC platform for the hybrid integration of an LD array chip and an LD driver IC will carry forward the development of high-speed optoelectronic modules with both optical and electrical signal processing functions.

We review recent progress in integrated photonics devices and their applications for datacom. In addition to current technology used in 100-Gigabit Ethernet (100GbE) with a compact form-factor of the transceiver, the next generation of technology for 400GbE seeks a larger number of wavelengths with a more sophisticated modulation format and higher bit rate per wavelength. For wavelength scalability and functionality, planar lightwave circuits (PLCs), such as arrayed waveguide gratings (AWGs), will be important, as well higher-order-modulation to ramp up the total bit rate per wavelength. We introduce integration technology for a 100GbE optical sub-assembly that has a 4λ x 25-Gb/s non-return-to-zero (NRZ) modulation format. For beyond 100GbE, we also discuss applications of 100GbE sub-assemblies that provide 400-Gb/s throughput with 16λ x 25-Gb/s NRZ and bidirectional 8λ x 50-Gb/s four-level pulse amplitude modulation (PAM4) using PLC cyclic AWGs.

Optoelectronic hybrid integration is a promising technology for realizing the optical components needed in optical transmission, switching, and interconnection systems that use wavelength division multiplexing (WDM) and time division multiplexing (TDM). We have already developed versatile optical hybrid integrated modules using a silica-based planar lightwave circuit (PLC) platform. However, these modules consist solely of the optoelectronic semiconductor devices such as laser diodes (LDs) and photo diodes (PDs) and monolithic optoelectronic integrated circuits (OEICs). To carry out high-speed and versatile electric signal processing functions in future network systems, it is necessary to install semiconductor electrical integrated circuits (ICs) on a PLC platform. In this paper, we describe novel technologies for high-speed PLC platforms which make it possible to assemble both ICs and optoelectronic devices. Using these technologies, we fabricated a two-channel hybrid integrated optical transmitter module which is hybrid integrated with an LD array chip and an LD driver IC. On this PLC platform, we use microstrip lines (MSLs) to drive the LD driver IC. We also considered the effect of heat interference on the LD array chip caused by the LD driver IC when designing the layout of the chip assembly region. The LD array chip and the LD driver IC were flip-chip bonded with solder bumps of a different material to avoid any deterioration in the coupling efficiency of the LD array chip. The optical transmitter module we fabricated operated successfully at 9 Gbit/s non-return-zero (NRZ) signal. This approach using a PLC platform for the hybrid integration of an LD array chip and an LD driver IC will carry forward the development of high-speed optoelectronic modules with both optical and electrical signal processing functions.