We present a high performance AlGaAs/GaAs power HBT with very low thermal resistance for digital cellular phones. Device structure with emitter air-bridge is utilized and device layout is optimized to reduce thermal resistance based on three-dimensional thermal flow analysis, and in spite of a rather thick substrate (100 µm), which achieved a low thermal resistance of 23/W for a multi-finger (440 µm240 fingers) HBT. This 40 finger HBT achieved power added efficiency (PAE) of over 53%, 29.1 dBm output power (Pout) and high associated gain (Ga) of 13.5 dB with 50 kHz adjacent channel leakage power (Padj) of less than -48 dBc under a 948 MHz π/4-shifted QPSK modulation with 3.4 V emitter-collector voltage. We also investigated the difference of RF performance between two bias modes (constant base voltage and current), and found which mode is adequate for each stage in several stage power amplifier for the first time.

This paper describes two different types of GaAs-HBT compatible, base-collector diode 0/20-dB step attenuators--diode-linearizer type and harmonics-trap type--for 3.5-GHz-band wireless applications. The two attenuators use an AC-coupled, stacked type diode switch topology featuring high power handling capability with low bias current operation. Compared to a conventional diode switch topology, this topology can improve the capability of more than 6 dB with the same bias current. In addition, successful incorporation of a shunt diode linearizer and second- and third-harmonic traps into the attenuators gives the IM3 distortion improvement of more than 7 dB in the high power ranging from 16 dBm to 18 dBm even in the 20-dB attenuation mode when IM3 distortion levels are basically easy to degrade. Measurement results show that both the attenuators are capable of delivering power handling capability (P0.2 dB) of more than 18 dBm with IM3 levels of less than -35 dBc at an 18-dBm input power while drawing low bias currents of 3.8 mA and 6.8 mA in the thru and attenuation modes from 0/5-V complementary supplies. Measured insertion losses of the linearizer-type and harmonics-trap type attenuators in the thru mode are as low as 1.4 dB and 2.5 dB, respectively.

This paper describes a 3.5 V operation InGaP HBT MMIC power amplifier module for use in GSM/EDGE dual-mode, 900/1800/1900 MHz triple band handset applications. Conventional GSM amplifiers have a high linear gain of 40 dB or more to realize efficiency operation in large gain compression state exceeding at least 5 dB. On the other hand, an EDGE amplifier needs a linear operation to prevent signal distortion. This means that a high linear gain amplifier cannot be applied to the EDGE amplifier, because the high gain leads to the high noise power in the receive band (Rx-noise). In order to solve this problem, we have changed the linear gain of the amplifier between GSM and EDGE mode. In EDGE mode, the stage number of the amplifier changes from three to two. To reduce a high gain, the first stage transistors in the amplifier is bypassed through the diode switches. This newly proposed bypass circuit enables a high gain in GSM mode and a low gain in EDGE, thus allowing the amplifier to operate with high efficiency in both modes while satisfying the Rx-noise specification. In conclusion, with diode switches and a band select switch built on the MMIC, the module delivers a Pout of 35.5 dBm and a PAE of about 50% for GSM900, a 33.4 dBm Pout and a 45% PAE for GSM1800/1900. While satisfying an error vector magnitude (EVM) of less than 4% and a receive-band noise power of less than -85 dBm/100 kHz, the module also delivers a 29.5 dBm Pout and a PAE of over 25% for EDGE900, a 28.5 dBm Pout and a PAE of over 25% for EDGE1800/1900.