The Euclidean projection operation is the most complex and time-consuming of the alternating direction method of multipliers (ADMM) decoding algorithms, resulting in a large number of resources when deployed on hardware platforms. We propose a simplified line segment projection algorithm (SLSA) and present the hardware design and the quantization scheme of the SLSA. In simulation results, the proposed SLSA module has a better performance than the original algorithm with the same fixed bitwidths due to the centrosymmetric structure of SLSA. Furthermore, the proposed SLSA module with a simpler structure without hypercube projection can reduce time consuming by up to 72.2% and reduce hardware resource usage by more than 87% compared to other Euclidean projection modules in the experiments.

Linear programming (LP) decoding based on the alternating direction method of multipliers (ADMM) has proved to be effective for low-density parity-check (LDPC) codes. However, for high-density parity-check (HDPC) codes, the ADMM-LP decoder encounters two problems, namely a high-density check matrix in HDPC codes and a great number of pseudocodewords in HDPC codes' fundamental polytope. The former problem makes the check polytope projection extremely complex, and the latter one leads to poor frame error rates (FER) performance. To address these issues, we introduce the even vertex algorithm (EVA) into the ADMM-LP decoding algorithm for HDPC codes, named as HDPC-EVA. HDPC-EVA can reduce the complexity of the projection process and improve the FER performance. We further enhance the proposed decoder by the automorphism groups of codes, creating diversity in the parity-check matrix. The simulation results show that the proposed decoder is capable of cutting down the average decoding time for each iteration by 30%-60%, as well as achieving near maximum likelihood (ML) performance on some BCH codes.

The electrical properties of poly-Si thin film transistors (TFTs) using rapid thermal annealing with various gate oxide thicknesses were studied in this work. It was found that Poly-Si TFT electrical characteristics with the thinnest gate oxide thickness after RTA treatment exhibits the largest performance improvement compared to TFT with thick oxide as a result of the increased incorporated amounts of the nitrogen and oxygen. Thus, the combined effects can maintain the advantages and avoid the disadvantages of scaled-down oxide, which is suitable for small-to-medium display mass production.

The stopping distance and stopping redundancy of a linear code are important concepts in the analysis of the performance and complexity of the code under iterative decoding on a binary erasure channel. In this paper, we studied the stopping distance and stopping redundancy of Finite Geometry LDPC (FG-LDPC) codes, and derived an upper bound of the stopping redundancy of FG-LDPC codes. It is shown from the bound that the stopping redundancy of the codes is less than the code length. Therefore, FG-LDPC codes give a good trade-off between the performance and complexity and hence are a very good choice for practical applications.

Using linear programming (LP) decoding based on alternating direction method of multipliers (ADMM) for low-density parity-check (LDPC) codes shows lower complexity than the original LP decoding. However, the development of the ADMM-LP decoding algorithm could still be limited by the computational complexity of Euclidean projections onto parity check polytope. In this paper, we proposed a bisection method iterative algorithm (BMIA) for projection onto parity check polytope avoiding sorting operation and the complexity is linear. In addition, the convergence of the proposed algorithm is more than three times as fast as the existing algorithm, which can even be 10 times in the case of high input dimension.

Large number of electronic connectors are widely used in various electronic and telecommunication systems. No matter whether it is optical telecommunications or mobile phone systems, connectors are important links for electronics. Unfortunately connector contacts are exposed in air, they are different from any other electronic components, the contacts are greatly influenced by the environment where they operate. In China, dust and corrosion products are the main contaminants to cause contact failure. Evidently the failed contacts seriously deteriorate the reliability of electronic and telecommunication systems. This paper summarizes the recent achievements obtained by our Lab on the effect of dust and corrosion products to the connector contact failure. Since dust contamination is a very complex problem which is not only popular in China, but also happened in many countries. Continuous studies will be very useful to improve the contact reliability of connectors, setting up new and effective testing methods and standards, building up experimental and computer simulation systems.