This paper shows that the Surrounding Gate Transistor (SGT) can be scaled down to decananometer gate lengths by using an intrinsically-doped body and gate work function engineering. Strong gate controllability is an essential characteristics of the SGT. However, by using an intrinsically-doped body, the SGT can realize a higher carrier mobility and stronger gate controllability of the silicon body. Then, in order to adjust the threshold voltage, it is necessary to adopt gate work function engineering in which a metal or metal silicide gate is used. Using a three-dimensional (3D) device simulator, we analyze the short-channel effects and current characteristics of the SGT. We compare the device characteristics of the SGT to those of the Tri-gate transistor and Double-Gate (DG) MOSFET. When the silicon pillar diameter (or silicon body thickness) is 10 nm, the gate length is 20 nm, and the oxide thickness is 1 nm, the SGT shows a subthreshold swing of 63 mV/dec and a DIBL of -17 mV, whereas the Tri-gate transistor and the DG MOSFET show a subthreshold swing of 71 mV/dec and 77 mV/dec, respectively, and a DIBL of -47 mV and -75 mV, respectively. By adjusting the value of the gate work function, we define the off current at VG = 0 V and VD = 1 V. When the off current is set at 1 pA/µm, the SGT can realize a high on current of 1020 µA/µm at VG = 1 V and VD = 1 V. Moreover, the on current of the SGT is 21% larger than that of the Tri-gate transistor and 52% larger than that of the DG MOSFET. Therefore, the SGT can be scaled reliably toward the decananometer gate length for high-speed and low-power ULSI.

A novel PND (PMOS-NMOS-Depletion MOS) technology for a single poly gate non-volatile memory cell design has been reported for the first time. This technology features memory cell design with a differential cell architecture which enables to provide the higher performance for the key specifications such as programming time, erasing time, and endurance characteristics. This memory cell consists of 3-Transistors, PMOS, NMOS, and Depletion MOS transistors (hereafter PND). The DMOS in this cell is used for the tunneling device in the erasing operation, while the NMOS and the PMOS are used for the tunneling device and the coupling capacitor in the programming operation, respectively. The proposed PND design can allow lower applied voltage of the erase-gate (EG) and control-gate (CG) in the erasing and the programming operations so that the endurance characteristics can be improved because the DMOS suppresses the potential of floating-gate (FG) and hence the effective potential difference between the EG and the FG can be increased in the erasing operation. Based on the measured data, it can be expected that the erasing speed of the PND cell can be 125-fold faster than that of our previously reported work (PN type). Therefore, high performance and high reliability CMOS non-volatile memory without any additional process can be realized using this proposed PND technology.