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Huanyu WANG Lina HUANG Yutong LIU Zhenyuan XU Lu ZHANG Tuming ZHANG Yuxiang FENG Qing HUA
This paper proposes the new series highly integrated intelligent power module (IPM), which is developed to provide a ultra-compact, high performance and reliable motor drive system. Details of the key design technologies of the IPM is given and practical application issues such as electrical characteristics, system operation performance and power dissipation are discussed. Layout placement and routing have been optimized in order to reduce and balance the parasitic impedances. By implementing an innovative direct bonding copper (DBC) ceramic substrate, which can effectively dissipate heat, the IPM delivers a fully integrated power stages including two three-phase inverters, power factor correction (PFC) and rectifier in an ultra-compact 75.5mm × 30mm package, offering up to a 17.3 percent smaller space than traditional motor drive scheme.
Jin-Cheon KIM Sang-Hoon LEE Joo-Hyun LEE Do-Young LEE Won-Chang JUNG Hong-June PARK Im-Soo MOK Hyung-Gyun KIM Ga-Woo PARK
A 32-bit motor-drive-specific microcontroller chip was newly designed, implemented using a 0.8 µm double-metal CMOS process, and its feasibility was successfully tested by applying the fabricated microcontroller chip to a real AC induction motor drive system. The microcontroller chip includes a single-precision floating-point unit, peripheral devices for motor drive, and a memory controller as well as the SPARC V7 CPU. The pipeline scheme and the two-step multiplication method were used in the multiplier of floating-point unit for the best area and speed trade-off, using the standard cell library available for the design. The chip size is 12.7 12.8 mm2, the number of transistors is around 562,000, and the power consumption is 1.69 W at the supply voltage of 5 V and the clock frequency of 30 MHz. Both a standard cell library and a full-custom layout were used in the implementation.